Front End Central Product Integration (FE cPIE) MTS (FE) at Micron Technology

Taichung, , Taiwan -

Full Time

Start Date

Immediate

Expiry Date

17 Jun, 26

Salary

0.0

Posted On

19 Mar, 26

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Process Integration, Structural Uniformity, Cross-Loop Integration, Yield Optimization, Quality Assurance, Reliability Engineering, Root Cause Analysis, Model-Based Analysis, Inline Monitoring, Product Integration, Node Transitions, Shift-Left Integration, Technical Alignment, Business Process Optimization, Semiconductor Fabrication, DRAM/NAND Operation

Industry

Semiconductor Manufacturing

Description

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Responsibilities: Lead process integration (PI) structural uniformity and cross‑loop integration for critical modules (e.g., capacitance loop), owning end‑to‑end integration strategies to resolve yield, quality, and reliability gaps. Drive physics‑ and process‑based integration solutions through close collaboration with cross‑module process owners, PI subject‑matter experts, and key suppliers to optimize integration structures and achieve BIC yield and quality targets. Develop and apply model‑based root cause analysis frameworks (transport, reaction kinetics, pattern density, and geometry‑dependent effects) to diagnose structural non‑uniformity. Define, implement, and continuously strengthen critical inline monitoring and defense lines (CD, film loss, mass delta, defectivity, edge/periphery metrics) to ensure robust control of structural uniformity. Own and advance product integration programs and loop‑level domain expertise, maintaining deep technical knowledge across node transitions. Proactively drive node‑over‑node “shift‑left” integration, including early implementation of uniformity, bevel, and backside best‑known‑methods (BKMs) during development phases to accelerate whole‑wafer (center‑to‑edge) yield and quality ramp. Drive worldwide technical alignment and execution excellence by leading global projects, standardizing and leveraging network BKMs, and scaling proven solutions across sites. Identify efficiency and performance gaps, and lead business process creation, optimization, and re‑engineering to improve benchmark performance, cycle time, and development productivity. Job Requirements: Good logical thinking and knowledge in Semiconductor Fabrication process flows, interaction of different processes and how changes affect yield, device performance and reliability. Understanding of DRAM and NAND operation and structure to decipher parametric, probe and qual data from both front end and backend assembly process. Good model based problem solving together with data driven decision making, and presentation skills. Proven ability to troubleshoot and solve structure and device related issues, and address root cause. Good organizational capabilities and ability to work effectively. Ability to be flexible with job responsibilities and take the initiative to assume added responsibilities. Travel to Micron sites as necessary for face to face collaboration. Strong interpersonal skills and customer/co-worker relationships. Successfully demonstrated teamwork skills with a strong focus on developing good team dynamics. Good multi-tasking, verbal and written communication skills. With more than 7 years relevant industries experience / knowledges. Bachelors/Masters/PhD. in EE, Materials Engineering, Materials Science, Physics and Chemical but optional if candidates have more than 10 years' experience in process related role in semiconductor industry. About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience. To learn more, please visit micron.com/careers All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status. To request assistance with the application process and/or for reasonable accommodations, please contact at hrsupport_taiwan@micron.com. Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards. Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron. AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification. Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.

Responsibilities

The role involves leading process integration for critical modules, owning end-to-end integration strategies to resolve yield, quality, and reliability gaps by driving physics- and process-based solutions. Responsibilities also include developing model-based root cause analysis frameworks and proactively driving node-over-node integration, including early implementation of best-known-methods.