Front End Central Product Integration (FE cPIE) Senior Manager/Member of Te at Micron Technology
Taichung, , Taiwan -
Full Time


Start Date

Immediate

Expiry Date

24 Feb, 26

Salary

0.0

Posted On

26 Nov, 25

Experience

10 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

No

Skills

Logical Thinking, Semiconductor Fabrication, FE-AT Interaction, Yield Performance, Reliability Performance, DRAM Operation, NAND Operation, Model Based Problem Solving, Data Driven Decision Making, Troubleshooting, Root Cause Analysis, Organizational Skills, Interpersonal Skills, Teamwork, Multi-tasking, Communication Skills

Industry

Semiconductor Manufacturing

Description
Define and execute FE-AT integration strategies aligned with business objectives. Oversee multiple FE-AT integration projects, develop model based root cause analysis and enhance FE-AT defense mechanisms. Good logical thinking and knowledge in Semiconductor Fabrication process flows, FE-AT interaction and how changes affect yield, and reliability performance. Understanding of DRAM and NAND operation and structure to decipher parametric, probe and qual data from both front end and backend assembly process. Good model based problem solving together with data driven decision making, and presentation skills. Proven ability to troubleshoot and solve structure and device related issues, and address root cause. Good organizational capabilities and ability to work effectively. Ability to be flexible with job responsibilities and take the initiative to assume added responsibilities. Strong interpersonal skills and customer/co-worker relationships. Successfully demonstrated teamwork skills with a strong focus on developing good team dynamics. Good multi-tasking, verbal and written communication skills. with more than 7 years relevant industries experience / knowledges. Bachelors/Masters/PhD. in EE, Materials Engineering, Materials Science, Physics and Chemical but optional if candidates have more than 10 years experience in process related role in semiconductor industry. Partner with cross functional teams from FE, AT, GQ and SMAI to resolve yield and reliability challenges. Drive global synergy through BKM sharing and process standardization. Establish KPIs for FE-AT integration performance and efficiency.
Responsibilities
Define and execute front end and assembly test integration strategies aligned with business objectives. Oversee multiple integration projects and enhance defense mechanisms.
Loading...