Start Date
Immediate
Expiry Date
16 Apr, 26
Salary
0.0
Posted On
16 Jan, 26
Experience
0 year(s) or above
Remote Job
Yes
Telecommute
Yes
Sponsor Visa
No
Skills
Die Bonding, Wire Bonding, Process Improvement, Troubleshooting, Root Cause Analysis, New Product Introduction, Process Qualification, Statistical Process Control, Yield Improvement, Reliability Testing, Failure Analysis, Automation, Process Optimization, Programming, Teamwork, Problem Solving
Industry
Semiconductor Manufacturing