Hardware Engineer - PCB CAD Designer at Microsoft

Redmond, Washington, United States -

Full Time

Start Date

Immediate

Expiry Date

12 Jun, 26

Salary

199000.0

Posted On

14 Mar, 26

Experience

2 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

PCB CAD, SI/PI, EE, Packaging, PCB Stack-ups, Routing Studies, High-Speed Design, High-Power Design, DRC, DFM, Cadence Allegro, Altium, Mentor Xpedition, HDI Via Technology, Signal Integrity, Power Integrity

Industry

Software Development

Description

Overview Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) is the team behind Microsoft’s expanding Cloud Infrastructure and responsible for powering Microsoft’s “Intelligent Cloud” mission. SCHIE delivers the core infrastructure and foundational technologies for Microsoft's over 200 online businesses including Bing, MSN, Office 365, Xbox Live, Teams, OneDrive, and the Microsoft Azure platform globally with our server and data center infrastructure, security and compliance, operations, globalization, and manageability solutions. Our focus is on smart growth, high efficiency, and delivering a trusted experience to customers and partners worldwide and we are looking for passionate engineers to help achieve that mission. As Microsoft's cloud business continues to grow the ability to deploy new offerings and hardware infrastructure on time, in high volume with high quality and lowest cost is of paramount importance. To achieve this goal, the CHSE (Cloud Hardware Systems Engineering) team is instrumental in defining and delivering operational measures of success for hardware manufacturing, improving the planning process, quality, delivery, scale and sustainability related to Microsoft cloud hardware. We are looking for seasoned engineers with a dedicated passion for customer focused solutions, insight and industry knowledge to envision and implement future technical solutions that will manage and optimize the Cloud infrastructure. We are looking for a Hardware Engineer – PCB CAD to join the team. Responsibilities Working with internal teams including SI/PI, EE and Packaging to develop AI and Compute platform PCBs. Participating in the development of PCB stack-ups for high-performance designs. Executing routing studies to explore solutions for challenging high-speed and high-power designs. Developing foundational PCB routing and constraints for production board designs. Engaging with ODMs and fabs to ensure that PCBs are designed to the quality, reliability, supply chain and cost requirements of Microsoft Azure and the programs. Guiding ODM CAD resources to make designs fabrication-ready. Overseeing PCB designs through DRC and DFM verification processes, and resolving issues found during this process. Qualifications Required Qualifications: Master's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 2+ years technical engineering experience OR equivalent experience. Other Requirements: Ability to meet Microsoft, customer and/or government security screening requirements are required for this role. These requirements include, but are not limited to, the following specialized security screenings: Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud background check upon hire/transfer and every two years thereafter. Preferred Qualifications: 3+ years of experience in PCB CAD for computer, FPGA and/or RF hardware designs. Expertise with Cadence Allegro, Altium and/or Mentor Xpedition. Experience with state-of-the-art PCB designs, including HDI via technology, high-layer counts, high-performance materials, etc. Experience with DRC/DFM checking and resolution of issues found through that process. Fundamental knowledge of Electromagnetic fundamentals and transmission line theory. Fundamental knowledge of CAD design for Signal Integrity and Power Integrity, including routing of high-speed interconnects from 25G to 224G+, and implementation of high-current power delivery networks. Strong written and verbal communication skills. Experience working across disciplines and organizations to resolve complex issues. Experience working with ODMs on execution of PCB CAD tasks. #SCHIE #CHSE #azurehwjobs Hardware Engineering IC3 - The typical base pay range for this role across the U.S. is USD $100,600 - $199,000 per year. There is a different range applicable to specific work locations, within the San Francisco Bay area and New York City metropolitan area, and the base pay range for this role in those locations is USD $131,400 - $215,400 per year. Certain roles may be eligible for benefits and other compensation. Find additional benefits and pay information here: https://careers.microsoft.com/us/en/us-corporate-pay This position will be open for a minimum of 5 days, with applications accepted on an ongoing basis until the position is filled. Microsoft is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to age, ancestry, citizenship, color, family or medical care leave, gender identity or expression, genetic information, immigration status, marital status, medical condition, national origin, physical or mental disability, political affiliation, protected veteran or military status, race, ethnicity, religion, sex (including pregnancy), sexual orientation, or any other characteristic protected by applicable local laws, regulations and ordinances. If you need assistance with religious accommodations and/or a reasonable accommodation due to a disability during the application process, read more about requesting accommodations.

Responsibilities

The role involves collaborating with internal teams to develop PCBs for AI and Compute platforms, including defining stack-ups and executing routing studies for high-performance designs. Responsibilities also include engaging with ODMs and fabs to ensure designs meet quality, reliability, and cost requirements, and overseeing DRC/DFM verification processes.