Hardware Engineering Manager at Lam Research

Tualatin, Oregon, United States -

Full Time

Start Date

Immediate

Expiry Date

12 Sep, 26

Salary

0.0

Posted On

14 Jun, 26

Experience

10 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Mechanical Architecture, Opto-mechanical Design, Electro-mechanical Systems, Engineering Management, NPI Lifecycle, DFx, Tolerance Analysis, Thermal Analysis, Structural Analysis, System Integration, Matrix Organization Leadership, Sensor Integration, CAD Layout, BOM Management, Cross-functional Collaboration, Reliability Engineering

Industry

Semiconductor Manufacturing

Description

The group you’ll be a part of You will be part of Lam Research’s Equipment Intelligence and Sensor Engineering organization within the Deposition Product Group (DPG). This team is responsible for developing next‑generation sensing, imaging, and data‑driven capabilities that enable differentiated performance across Lam’s product portfolio. The organization focuses on integrating advanced sensor systems—including optical, thermal, acoustic, chemical, and multi‑modal sensing—into semiconductor capital equipment to enable real‑time visibility, control, and optimization. This includes development of modular sensor platforms, edge compute architectures, and scalable system integrations that support both new product introduction (NPI) and installed base enhancement. Our teams operate at the intersection of mechanical systems, optics, electronics, controls, software, and data science—partnering globally to deliver robust, high‑performance solutions that accelerate innovation, improve tool intelligence, and enable next‑generation capabilities across all Lam product lines. The organization operates in a matrix structure, where mechanical, electrical, optical, and software engineers collaborate closely across shared programs and platforms, requiring strong cross-functional alignment and shared ownership of outcomes. The impact you’ll make As a Hardware/Mechanical Engineering Manager within the Equipment Intelligence and Sensor Engineering team, you will play a critical leadership role in enabling the mechanical architecture, integration, and deployment of advanced sensor systems across Lam platforms. Your work will directly impact the scalability, reliability, and performance of sensing solutions that drive equipment intelligence—enabling improved process control, fault detection, and system optimization. You will lead a team responsible for designing and integrating complex opto‑mechanical and electro‑mechanical assemblies, working in close partnership with Electrical Engineering, Firmware Engineering, and other functional teams to ensure cohesive system architectures to build sensor sub-systems that are robust, manufacturable, and seamlessly integrated at the system level. Success in this role requires effective leadership within a matrix organization, influencing functional boundaries while maintaining accountability for mechanical deliverables. This role requires balancing deep technical engagement with strong execution discipline across fast‑paced NPI and innovation programs. This is a high‑visibility position where your leadership will influence platform strategy, cross‑product standardization, and the evolution of modular sensing architectures across Lam. This role sits at the forefront of transforming traditional semiconductor equipment into intelligent, sensor‑rich systems. You will have the opportunity to shape platform‑level architectures that combine hardware, sensing, and data—impacting not just a single product, but the evolution of equipment intelligence across an entire portfolio. What you’ll do Lead Mechanical Architecture for Sensor Systems Define and drive mechanical architectures for advanced sensor platforms, including imaging systems, optical assemblies, and integrated sensing modules. Enable modular, scalable designs that can be deployed across multiple product lines and applications. Guide design tradeoffs across performance, integration constraints, reliability, and cost. Own Design Quality and System Integration Ensure designs meet functional, environmental, reliability, and safety requirements. Drive strong integration with Systems Engineering to ensure robust subsystem interfaces and system‑level performance. Review mechanical designs, CAD layouts, tolerance analyses, and BOM structures. Drive DFx and Production Readiness Ensure designs meet manufacturability, serviceability, reliability, and cost targets. Partner closely with Manufacturing Engineering, Supply Chain, and Operations to enable smooth transition to production and scale. Promote platform reuse, component standardization, and cost optimization. Electrical, Firmware, and System Co‑Design Work closely with Electrical Engineering leadership to define integrated hardware architectures for sensor and equipment intelligence systems. Ensure mechanical designs support electrical requirements including EMI/EMC, thermal performance, routing constraints, and maintainability. Enable tight integration between mechanical packaging, electronics, and sensing elements to achieve performance and reliability targets. Work closely with Firmware Engineering to define hardware‑firmware interfaces, including sensor control, data pipelines, and real‑time system interactions. Ensure mechanical designs support firmware and system requirements such as access for debugging, calibration workflows, and updateability in production and field environments Who we’re looking for You are a technically strong and hands‑on engineering leader who thrives at the intersection of hardware and intelligence systems. You enjoy building teams, solving complex integration challenges, and translating emerging technologies into scalable engineering solutions. You excel in matrix organizations, building strong partnerships with peer managers, and aligning cross-functional teams toward common objectives. You are comfortable operating in ambiguity, driving early‑stage innovation while maintaining execution discipline required for productization. You are effective at aligning hardware and firmware teams under shared leadership, ensuring seamless integration between mechanical systems and embedded functionality. Bachelor's degree in mechanical engineering (BSME) with 10+ years of experience, OR Master’s degree (MSME) with 7+ years of experience, OR PhD with 5+ years of experience. A portion of experience in engineering management or technical leadership roles. Demonstrated ability to lead and develop teams aligned with Lam core values and a high‑performance culture. Strong background in design of complex electro‑mechanical or opto‑mechanical systems. Experience leading engineering efforts through product development or NPI lifecycles. Experience working in matrix organizations with cross‑functional ownership across multiple disciplines. Experience collaborating with Electrical and Firmware teams on integrated hardware systems. Preferred qualifications Experience with semiconductor capital equipment or similar high‑complexity systems. Background in optical systems, imaging, or sensor integration. Strong understanding of: DFMEA and reliability engineering Tolerance analysis and precision design Thermal and structural analysis Experience with modular platform development and cross‑product standardization. Exposure to sensor systems, edge compute platforms, or data‑driven system architectures. Experience supporting production ramp and field issue resolution. Demonstrated success in mentoring senior engineers and building high‑impact technical teams. Experience collaborating closely with Electrical Engineering teams on integrated hardware/system design. Demonstrated success influencing across organizational boundaries and aligning multiple stakeholders in complex development environments. Experience working with embedded systems and firmware‑driven hardware platforms. Familiarity with hardware‑firmware co‑design, including sensor control, data acquisition, and real‑time system behavior. Our commitment We believe it is important for every person to feel valued, included, and empowered to achieve their full potential. By bringing unique individuals and viewpoints together, we achieve extraordinary results. Lam Research ("Lam" or the "Company") is an equal opportunity employer. Lam is committed to and reaffirms support of equal opportunity in employment and non-discrimination in employment policies, practices and procedures on the basis of race, religious creed, color, national origin, ancestry, physical disability, mental disability, medical condition, genetic information, marital status, sex (including pregnancy, childbirth and related medical conditions), gender, gender identity, gender expression, age, sexual orientation, or military and veteran status or any other category protected by applicable federal, state, or local laws. It is the Company's intention to comply with all applicable laws and regulations. Company policy prohibits unlawful discrimination against applicants or employees. Lam offers a variety of work location models based on the needs of each role. Our hybrid roles combine the benefits of on-site collaboration with colleagues and the flexibility to work remotely and fall into two categories – On-site Flex and Virtual Flex. ‘On-site Flex’ you’ll work 3+ days per week on-site at a Lam or customer/supplier location, with the opportunity to work remotely for the balance of the week. ‘Virtual Flex’ you’ll work 1-2 days per week on-site at a Lam or customer/supplier location, and remotely the rest of the time. Our Perks and Benefits At Lam, our people make amazing things possible. That’s why we invest in you throughout the phases of your life with a comprehensive set of outstanding benefits.

Responsibilities

Lead the mechanical architecture and integration of advanced sensor systems for semiconductor equipment. Manage a cross-functional team to deliver robust, manufacturable opto-mechanical assemblies while aligning with electrical and firmware teams.