Hardware PCB Layout Engineer (Power Module)_EM at Bosch Group

Suzhou, Jiangsu, China -

Full Time

Start Date

Immediate

Expiry Date

04 Aug, 26

Salary

0.0

Posted On

06 May, 26

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

PCB Layout Design, High-Voltage Systems, Signal Integrity, Power Integrity, EMI/EMC Mitigation, Zuken CR8000, Altium Designer, Allegro PCB Designer, Mentor Graphics, DFM/DFT, Thermal Management, Impedance Control, Schematic Design, Power Distribution Network, Magnetics Integration

Industry

Software Development

Description

Company Description Do you want beneficial technologies being shaped by your ideas? Whether in the areas of mobility solutions, consumer goods, industrial technology or energy and building technology - with us, you will have the chance to improve quality of life all across the globe. Welcome to Bosch. Job Description PCB Design – Create and validate multilayer PCB layouts for high-voltage systems, primarily for automotive power modules (e.g., OBC, DCDC, CCON, and other charger/converter topologies). Schematic & Layout Design – Generate schematics and execute complex component placement and routing, ensuring compliance with high-voltage isolation, creepage/clearance requirements, impedance control, and power‑module‑specific layout rules. Signal & Power Integrity – Analyze and simulate layout characteristics to ensure signal integrity, optimize power distribution network (PDN), minimize loop area, control switching noise, and mitigate EMI/EMC issues. Magnetics Integration – Manage PCB layout and routing for magnetic components (transformers, inductors), optimize trace routing between magnetics and power switches, and reduce leakage inductance and power losses. Manufacturing Support – Generate manufacturing and assembly data packages (e.g., Gerber files), collaborate with fabrication and assembly partners to ensure Design for Manufacturing (DFM) and Design for Testing (DFT). Create and maintain component footprints. Team Collaboration – Work closely with electrical engineers (hardware) and mechanical engineers to translate requirements into final PCB designs, with special attention to thermal management, housing integration, and board outline/shape. Verification & Review – Lead and participate in design reviews to ensure compliance with specifications, safety standards (e.g., IEC 60664), industry standards (e.g., IPC), and internal best practices. 职责描述： PCB设计：创建并验证用于高压系统的多层PCB布局，主要面向汽车电源模块（如 OBC、DCDC、CCON 等充电与变换器拓扑）。原理图与布局设计：根据原理图完成复杂的元器件布局和布线，确保符合高压隔离、安规间距、阻抗控制及电源模块特有的布局要求。信号与电源完整性：分析和仿真布局特性，优化电源分配网络（PDN），减小环路面积，控制开关噪声，并减轻 EMI/EMC 问题。磁件集成：负责变压器、电感等磁性元件在 PCB 上的布局与布线，优化磁件与功率管的走线，减小漏感和损耗。制造支持：生成制造和装配数据包（如 Gerber 文件），并与制造和装配伙伴协作，确保设计的可制造性（DFM）和可测试性（DFT）。负责元器件封装的建立与维护。团队协作：与电气工程师（硬件）、机械工程师紧密合作，将需求转化为最终的 PCB 设计，尤其关注散热结构、壳体配合与板形设计。验证与评审：主导并参与设计评审，确保设计符合规范、安规标准（如 IEC 60664）、行业标准（如 IPC）及内部最佳实践。 Qualifications Education – Bachelor's degree in Electrical Engineering, Electronic Engineering, or a related field. Work Experience – Several years of PCB design experience in automotive electronics or high‑voltage power applications. Experience with OBC, DCDC, or switch‑mode power supply (SMPS) layout is preferred. Software Skills – Proficiency in PCB design tools such as Zuken CR8000, Altium Designer, Allegro PCB Designer, or Mentor Graphics. Familiarity with simulation tools like Hyperlynx, AutoCASE, and/or EMC Advisor is a plus. Technical Knowledge – Solid understanding of high‑voltage safety and isolation techniques, creepage/clearance calculation, impedance‑controlled routing, switch‑mode power supply layout practices, EMI/EMC mitigation methods, and multi‑layer stack‑up design. Problem‑Solving – Detail‑oriented, able to think independently and solve layout‑related technical issues in high‑voltage, high‑current, and space‑constrained environments. Communication – Excellent verbal and written communication skills, able to collaborate effectively with cross‑functional teams (including German/English native‑speaking colleagues and suppliers). Fluent English is required for technical discussions, document reading, and meetings. German is a plus. 职位要求：教育背景：通常要求电气工程、电子工程或相关专业学士学位。工作经验：拥有多年汽车电子或高压电源应用领域的 PCB 设计经验，有 OBC、DCDC 或开关电源 Layout 经验者优先。软件技能：精通 PCB 设计工具，如 Zuken CR8000、Altium Designer、Allegro PCB Designer、Mentor Graphics 等。熟悉仿真工具如 Hyperlynx、AutoCASE 和/或 EMC Advisor 者优先。技术知识：深入理解高压安规与隔离技术、爬电距离与电气间隙计算、阻抗控制布线、开关电源布局技巧、EMI/EMC 抑制方法及多层叠层设计。解决问题能力：注重细节，能够在高压、大电流、有限空间内独立思考并解决 Layout 相关的技术问题。沟通能力：出色的口头和书面沟通能力，能够与跨职能团队（包括德语/英语母语的同事及供应商）高效协作。要求英语沟通流利，能够无障碍地进行技术讨论、文档阅读和会议交流。博世集团网上招聘数据处理同意声明个人信息及目的：你的如下个人信息将被处理并用于招聘：姓名、电子邮箱、电话号码、所在地区、经验和教育信息、简历等应聘者自主提交的附件信息、证件号、职位、部门、计划入职日期、劳动合同持续时间、工作地点、月薪、年薪、浮动奖金比例、餐贴、车贴。博世将依据相关的数据保护法规，在全球范围内对您的数据进行保密。招聘流程中，您的个人信息只有在必须时才会被提供给博世以外的第三方机构(如代理机构)。博世精心挑选了第三方机构并与之签订了保密合同。博世采取了种种保密措施以保护您的数据，确保其不会遭受操纵、丢失、破坏、未经授权的访问或泄漏。我们的安全措施将随着新技术的应用而不断升级。您的本地浏览器和我们的人才招募系统之间的数据传输通过https加密。特定职位申请：申请博世集团的职位就意味着您将自己的个人信息提供给博世集团旗下相应的法律实体（具体请见博世集团法人清单）。请注意，若有任何文件或资料变更，请在所有申请书里一并变更。人力资源部门的员工可能与您联系，询问您是否同意将您的求职申请转向博世集团内部另一合适职位。如果您申请了特定职位，那么只有在您同意的情况下，博世才会将您的求职申请转向另一职位。您可以随时撤回求职申请，博世将根据相关法律删除您的个人信息。与您的申请相关的所有资料将被保留至24个月。您的权利：若您希望停止向博世提供您的个人信息，可联系我们或通过博世网上招聘数据隐私声明中的BKMS系统提出申请。您可以在SmartRecruiters平台查阅和修改您的简历。您对您的个人信息的处理享有知情权、决定权，您有权限制或者拒绝我们对您的个人信息进行处理。您还可以更正、补充您的个人信息。跨境传输：为了实现前述目的，我们所收集的您的个人信息可能会在多个国家或地区间进行跨境转移，例如德国、新加坡。德国：罗伯特-博世有限公司（德国格宁根市罗伯特博世广场1号（Robert-Bosch-Platz 1, Gerlingen-Schillerhohe, Germany，邮编：70839），用于集团统一招聘管理（博世中国与数据接收方均基于该目的开展数据出境活动；英国：SmartRecruiters（英国伯克郡温莎亚瑟路圣斯蒂芬大厦邮政区码: SL4 1RU），用于招聘、后期交流联系及分享职位/活动信息、潜在人才社区邀请。您可通过上述联系方式依法向境外接收方行使您在个人信息处理活动中的权利。存储您的个人信息：我们将仅在为实现目的必要的范围内以及法律法规要求的时间内保留您的个人信息。雇佣：被雇佣后，您提供的数据将被从当前招聘系统转移至职位所属公司的人力资源管理系统。联系方式：请通过访问博世中国官方主页：博世在中国＞加入博世＞工作机会，在网上招聘数据隐私声明中“9.联系方式” 博世集团法人清单：请通过访问博世中国官方主页：博世在中国＞加入博世＞工作机会，在网上招聘数据隐私声明中获取现阶段使用网上招聘系统的博世集团法人（第五页） Legal Entity: Bosch Automotive Products (Suzhou) Co., Ltd.

Responsibilities

Design and validate multilayer PCB layouts for automotive high-voltage power modules, ensuring compliance with safety and isolation standards. Collaborate with cross-functional teams to optimize signal/power integrity and manage manufacturing data packages.