Hardware Product Manager - Smart Ring at Kirin

Shenzhen, Guangdong, China -

Full Time

Start Date

Immediate

Expiry Date

28 Mar, 26

Salary

0.0

Posted On

28 Dec, 25

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Hardware Execution, BLE SoC, MCU, PPG Sensors, IMU Sensors, Temperature Sensors, Microphone, Audio Front End, Battery Management, Wireless Charging, Debugging, Prototype Validation, ODM Collaboration, EVT/DVT/PVT Cycles, Firmware Collaboration, Low-Power Design

Industry

Financial Services

Description

We are building a next-generation smart ring that combines health and fitness tracking with a press-to-record voice feature. This role owns hardware execution end to end, working closely with ODM/CM partners. Responsibilities Own the smart ring hardware system and electrical architecture: BLE SoC / MCU PPG, IMU, temperature sensors Microphone and audio front end Battery, PMIC, and wireless charging Work directly with ODM engineers on schematics, PCB layout, and design trade-offs (size, power, RF, cost). Lead power, RF, and sensor performance validation in real-world use. Bring up and debug EVT/DVT prototypes; troubleshoot power, RF, sensor, and audio issues using lab tools. Drive fast design iterations while ensuring DFM/DFT readiness. Define hardware test coverage for EVT/DVT/PVT and review factory test fixtures and processes. Support NPI, analyze build data, and drive fixes through to mass production. Act as the China-side hardware owner, keeping HQ and factories aligned on risks, decisions, and timelines. Requirements 5+ years of consumer electronics hardware experience, ideally wearables or small devices. Strong in low-power BLE systems, mixed-signal design, and battery-powered products. Hands-on with bring-up, debugging, and prototype validation. Experience working with China-based ODM/CMs and EVT/DVT/PVT cycles. Able to work closely with firmware teams and understand HW/FW trade-offs. Nice to Have PPG or health wearable experience. Microphone and audio chain experience in small form-factor devices. Smart ring, TWS, or jewelry-class electronics background. Mandarin and English proficiency. 我们正在打造一款新一代智能戒指，结合健康与运动监测，并支持按压式语音记录功能。该职位常驻中国，全面负责硬件落地与执行。总部负责产品定义与路线图，你负责让硬件在现实中真正可用，并与代工厂 / 组装厂紧密合作。主要职责负责智能戒指整体硬件系统与电气架构，包括：低功耗 BLE SoC / MCU PPG、IMU、温度传感器麦克风与音频前端电池、PMIC 与无线充电与代工厂工程师直接合作，推进原理图、PCB 布局及关键设计取舍（尺寸、功耗、射频、成本）。主导功耗、射频与传感器性能在真实使用场景下的验证。负责 EVT / DVT 样机硬件带板与调试，使用实验室设备排查功耗、射频、传感器及音频问题。在快速迭代设计的同时，确保 DFM / DFT 与量产可行性。定义 EVT / DVT / PVT 阶段的硬件测试覆盖，并审核工厂测试夹具与流程。支持 NPI 与量产导入，分析打样和量产数据，推动问题闭环解决。作为中国端硬件负责人，保持总部与工厂在进度、风险和决策上的一致。任职要求 7 年以上消费电子硬件经验，优先可穿戴或小型设备背景。熟悉低功耗 BLE 系统、混合信号设计及电池供电产品。强动手能力，能独立完成样机带板与问题调试。有中国代工厂 / 组装厂合作经验，熟悉 EVT / DVT / PVT 流程。能与固件团队紧密配合，理解软硬件取舍。加分项健康可穿戴或 PPG 生物传感经验。小型设备（如 TWS、可穿戴）麦克风与音频链路经验。智能戒指或首饰类电子产品经验。中英文工作沟通能力。

Responsibilities

The Hardware Product Manager will own the smart ring hardware system and electrical architecture, working closely with ODM engineers on design and validation. They will also drive fast design iterations and ensure readiness for mass production.