Hardware Team Lead at Newphotonics

Petah Tikva, Center District, Israel -

Full Time

Start Date

Immediate

Expiry Date

21 Feb, 26

Salary

0.0

Posted On

23 Nov, 25

Experience

10 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Electrical Engineering, Board Design, Project Management, Cadence Tools, PCB Technologies, High-Speed Design, Lab Skills, ASIC Design Flow, Manufacturing, Electromagnetic Simulations, Transmission Lines, Impedance Control, Optical Transceivers, Lab Automation, Photonic Integration, S-Parameters

Industry

Semiconductor Manufacturing

Description

About the Job Our Hardware group leads the development of electro-optical devices and systems for next-generation data centers. NewPhotonics is revolutionizing data center processing with novel photonic engines that address power and performance challenges. We are looking for a Hardware Engineer Director to join our dynamic team and play a key role in shaping the technological landscape of our organization. What You’ll Be Doing: Participate in the research and development of next-generation electro-optical (EO) devices and sub-systems for high-speed communication. Define electrical specifications for EO sub-systems and evaluation boards, including schematic design, component selection, characterization, layout considerations, and implementation. Provide guidance on fabrication and assembly. Work with advanced PCB technologies such as MLO, mSAP and SLP Develop high-speed designs supporting speeds up to 224 Gbps. Lead board bring-up, characterization, and debug, including high-speed scope and VNA measurements. Collaborate with hardware project teams, including Board Design, Mechanics, Thermal, PCB Layout, Production, Software/Firmware, Photonics, and more. Utilize state-of-the-art laboratory equipment. Requirements What We’re Looking For: B.Sc. in Electrical Engineering. Experience in design ownership on major blocks/clusters from definition through implementation phases. 10+ years as a board designer with experience in executing complex hardware projects. Proven experience in leading multi-disciplinary projects. Hands-on experience with Cadence tools (Allegro, OrCAD) for schematic capture and PCB layout. Strong hands-on lab skills. Experience with advanced PCB materials and technologies (MLO, mSAP, SLP, HDI). Understanding of ASIC design flow, substrate design, and packaging. Experience in designing products for high-volume manufacturing. Strong project management skills, independence, and excellent interpersonal abilities. Proven proficiency in ANSYS HFSS / SIwave / 3D Layout for electromagnetic, SI, and PI simulations. Strong understanding of transmission lines, impedance control, crosstalk, and return-path design. Ability to interpret and simulate S-parameters, eye diagrams, and frequency-domain models. Familiarity with lab equipment such as oscilloscopes, VNAs, and spectrum analyzers. What Will Make You a Star Candidate: Experience with optical transceivers. Familiarity with optical or photonic integration (CPO/LPO) environments. Experience in lab automation using Python-based tools. Familiarity with IEEE standards. Knowledge of photonic integration technology and its ecosystem.

Responsibilities

The Hardware Team Lead will participate in the research and development of next-generation electro-optical devices and sub-systems for high-speed communication. They will define electrical specifications and lead board bring-up, characterization, and debug efforts.