High-Speed I/F Subsystem Design Leader at Renesas Electronics

Kodaira, , Japan -

Full Time

Start Date

Immediate

Expiry Date

01 Jul, 26

Salary

0.0

Posted On

02 Apr, 26

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

PCIe, UCIe, USB, UFS, SoC design, Logic design, Verification, Technical leadership, Specification definition, Architectural study, Power domain separation, Physical implementation, Functional safety, Reliability engineering, Cross-functional collaboration, English communication

Industry

Semiconductor Manufacturing

Description

Job Description 【【Background of the Recruitment】】 As vehicles become increasingly electrified and intelligent, automotive SoCs are now positioned as a central technology supporting vehicle performance and functionality. The R-Car series has continued to grow as a large‑scale SoC through the advanced integration of numerous and diverse IPs, including CPU, memory, high‑speed interfaces, AI, video, functional safety, and security. Our organization is responsible not only for in‑house IP development but also for the selection, integration, and implementation of external IPs, making the strengthening of technical leadership in core areas such as the High-Speed I/F subsystem a key focus. Against this background, we are seeking technical leaders who can define design direction, make sound technical decisions, and move development forward in collaboration with surrounding teams and IP vendors. This role offers an opportunity for engineers who wish to drive development with a strong technical foundation while preparing to take on broader responsibilities in the future. 【Job Description】 Play a key role in specification definition and architectural study of the High-Speed I/F subsystem for automotive SoCs (R-Car series). Work on the High-Speed I/F subsystem including PCIe, UCIe, USB and UFS-related areas, and organize design directions from a subsystem-level optimization perspective while owning a primary technical area. During logic design and verification phases, identify and structure technical issues, contribute to design decisions, and help drive development forward. Consider constraints such as power, performance, and reliability, and make technical judgments consistent with overall SoC requirements. For integrated third‑party IPs, communicate with IP vendors to confirm specifications, clarify constraints/assumptions, and support issue resolution. Collaborate with design teams in India and Vietnam and with IP vendors, working in English within a global development environment. ※The full details regarding your position scope as well as any future potential changes in work location and job scope will be provided during the interview process. Qualifications 【MUST】 Hands-on experience in at least one of PCIe, UCIe, USB, UFS, including specification study, design, verification, or performance evaluation: Ability to organize design directions and key discussion points based on requirements and share them with stakeholders. Understanding of the logic design and verification flow, and experience actively participating in technical reviews/discussions. Communication skills to collaborate across teams and contribute to technical consensus building. Willingness and ability to communicate in English for technical meetings and specification reviews. 【WANT】 Experience taking a technical lead role at subsystem or IP level (e.g., leading design reviews, guiding technical discussions). Experience in SoC integration involving PCIe, UCIe, USB and UFS-related components. Knowledge of power domain separation and physical implementation considerations (e.g., P&R). Experience in automotive SoC development or design/verification with functional safety or reliability considerations. Experience in technical communication and coordination with overseas sites and/or third‑party IP vendors. Japanese language proficiency at a conversational level Additional Information If you are interested in this position, please feel free to contact us at the details below: Recruiter:Masana Ueno ルネサスは、「To Make Our Lives Easier 」（人々の暮らしを楽“ラク”にする）というPurposeの下、組み込み半導体ソリューションを提供します。高品質とシステムレベルノウハウを兼ね備えた組み込み半導体のリーダーとして、自動車、産業、インフラ・IoT分野向けに、ハイパフォーマンスコンピューティング、組み込みプロセッシング、アナログ＆コネクティビティ、そしてパワーを含めた幅広い製品ポートフォリオを軸とした、スケーラブルで包括的なソリューションを提供しています。ルネサスは、30か国以上で22,000 人を超える多様性あふれる従業員と共に、限界に挑戦しながら、デジタライゼーションを通じてユーザエクスペリエンスを充実化させ、新たなイノベーションの時代を切り開いていきます。そして世界中の人々やコミュニティの未来のために、持続可能で省エネ効果の高いソリューションの開発に全力で取り組み、「To Make Our Lives Easier」を実現します。ルネサスで実現できることキャリアをスタート、そしてキャリアアップ：4つのプロダクトグループをはじめ、さまざまな部門において技術職として、また幅広いビジネスの経験を積むことができます。ハードウェア、ソフトウェアの専門知識を深めたり、新しいことにチャレンジしたりする機会があります。やりがいとインパクトのある仕事をする：革新的な製品とソリューションの開発に関わることにより、世界中のお客様のニーズに応えると同時に、人々の生活をより便利で安全かつ安心なものにすることに貢献できます。「ウェルビーイング」に焦点を置いた環境で最大限に能力を発揮する：ルネサスでは、リモートワーク制度などによる柔軟な勤務体制づくり、また従業員リソースグループの積極的な活動をサポートするなど、インクルーシブな職場環境構築を目指しています。従業員を第一に考えたカルチャーとグローバルなサポート体制が、入社後すぐに活躍できる環境を提供します。自分の力で成功を掴み、キャリアを築く準備はできていますか？ルネサスで一緒に未来を形づくっていきましょう。当社では、ハイブリッド勤務モデルを採用しており、従業員は週に2日間リモートワークを行うことができます。同時に、残りの日はチームとしてオフィスに集まり、協働を強化しています。出社指定日は火曜日から木曜日で、イノベーション、コラボレーション、そして継続的な学習に取り組む日としています。 Employment Type: Regular (PERM) Remote Work Available: No

Responsibilities

Lead the specification definition and architectural design of the High-Speed I/F subsystem for automotive SoCs. Collaborate with global design teams and IP vendors to ensure technical consistency and resolve development issues.