IC Package Design Engineer at Apple

, Texas, United States -

Full Time

Start Date

Immediate

Expiry Date

03 Aug, 26

Salary

0.0

Posted On

05 May, 26

Experience

10 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

IC Package Design, Cadence Allegro, Mentor Xpedition, SiP, PoP, Wirebond, Calibre, CAM350, Signal Integrity, Power Integrity, HFSS, PowerSI, Python, Perl, TCL, DFM

Industry

Computers and Electronics Manufacturing

Description

Our Packaging team defines, designs, and integrates advanced electronic packaging solutions for Apple’s internal and custom components across products including iPhone, iPad, Mac, Apple Watch, and Apple TV. We’re looking for a Package Design Engineer to drive the physical design and integration of advanced semiconductor packages across SoC, memory, RF, and cellular technologies. You will play a key role in shaping the architecture, scalability, and efficiency of next-generation products while advancing design methodologies through automation and AI. DESCRIPTION As a Package design engineer, you will lead advanced package architecture, drive next-generation package structure and configuration optimization, and own Package/SiP/module physical design from concept through tape-out. You will collaborate closely with cross-functional teams to deliver optimized SI/PI performance across a wide range of silicon technologies You are expected to leverage AI tools to enhance design efficiency, quality and performance. MINIMUM QUALIFICATIONS BS and 10+ years of relevant industry experience PREFERRED QUALIFICATIONS Package Design Proficiency: Proven experience in IC package physical design using Cadence Allegro or Mentor Xpedition platforms, with knowledge of diverse package types (SiP, PoP, wirebond) and verification tools (Calibre, CAM350). High-Speed & SI/PI Expertise: Strong understanding of high-speed interface layout constraints (DDR, PCIe) and Signal/Power Integrity (SI/PI) analysis, including experience with simulation tools like HFSS or PowerSI and parasitic extraction (RLGC, S-parameters). Manufacturing & Materials Knowledge: Solid grasp of substrate manufacturing processes, design rules (DRC), design for manufacturability (DFM), and various sophisticated package configurations and assembly technology Automation & Scripting Skills: Familiarity with a Unix/Linux environment and proficiency in scripting languages such as Python, Perl, or TCL to automate design tasks and improve workflows.

Responsibilities

Lead advanced package architecture and drive the physical design of semiconductor packages from concept through tape-out. Collaborate with cross-functional teams to optimize SI/PI performance and leverage AI tools to enhance design efficiency.