IC Packaging Engineer at NVIDIA

Yokneam Ilit, Haifa District, Israel -

Full Time

Start Date

Immediate

Expiry Date

22 Jun, 26

Salary

0.0

Posted On

24 Mar, 26

Experience

2 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

IC Packaging, Microelectronics Packaging, ASIC Packages, SI, Layout, Design, DFM, Tooling Design, Material Properties, Metrology Tools, FEA Mechanical Simulation, Failure Analysis, Reliability, Yield Improvement, ArtiosCAD, NX/SolidWorks/Creo

Industry

Computer Hardware Manufacturing

Description

NVIDIA has been transforming computer graphics, PC gaming, and accelerated computing for more than 25 years. It’s a unique legacy of innovation that’s fueled by great technology—and amazing people. Today, we’re tapping into the unlimited potential of AI to define the next era of computing. An era in which our GPU acts as the brains of computers, robots, and self-driving cars that can understand the world. Doing what’s never been done before takes vision, innovation, and the world’s best talent. As an NVIDIAN, you’ll be immersed in a diverse, supportive environment where everyone is inspired to do their best work. Come join the team and see how you can make a lasting impact on the world. Are you ready to take your engineering career to the next level? NVIDIA, a world-class technology company, is seeking a passionate Package Engineer to join our team in Israel. In this role, you will have the opportunity to collaborate with several design and program teams in the development of sophisticated IC substrates for our groundbreaking products. At NVIDIA, we are committed to delivering exceptional solutions in a wide range of sectors, and we are looking for engineers who share our passion and dedication to making a difference in the world through their inventions. As a Package Engineer, you will work closely with SI, layout, and ASIC design teams to develop complex, top-of-the-line ASIC packages. You will be responsible for planning schedules, resolving costs, packaging, manufacturing, and electrical design issues. What you will be doing: Leading development of cutting-edge microelectronics packaging of NVIDIA Networking Business Unit’s future products, evaluating NVIDIA products for reliability and performance. Review manufacturability readiness at each milestone. Work with world leading vendors to develop highly challenging packaging solutions. Leading the development of groundbreaking microelectronics packaging for NVIDIA Networking Business Unit's future products Collaborating with world-leading vendors to develop highly ambitious packaging solutions Thriving in a dynamic and challenging environment Join and lead task forces to investigate and support production excursions, failure analysis and reliability issues and establish quality standards. Monitor substrate and assembly production KPIs and collaborate with cross functional teams to define and monitor Yield Improvement Plans for continuous improvement and establish quality standards. Lead process changes reviews, prepare and present data in Change Control Board meetings, lead technical reviews of product changes throughout the supply chain. What we need to see: BSc or equivalent Mechanical/Material Engineering degree, or any related equivalent experience. 2+ years of relevant work experience in the semiconductor packaging or equivalent experience, development and manufacturing. Basic design skills, such as using 2D ArtiosCAD, and 3D NX/SolidWorks/Creo applications. Experience in DFM, understand tooling design, manufacturing processes, material properties and metrology tools. High awareness for quality, robustness, and manufacturability. High self-learning and self-motivation skills, fostering a culture of continuous learning, ongoing process improvement and proactive approach. Leadership skills, capability to lead cross company projects that involve cross functional teams in different locations. Curious and creative problem solver, well organized and multi-tasker. Ways to stand out of the crowd: Hands-on FEA mechanical simulation experience - Advantage Team / Group / Project management - Advantage Experience with manufacturing environment and manufacturing statistics tools Background in engineering semiconductor manufacturing processes Join us at NVIDIA, an equal-opportunity employer that values diversity and inclusion. We do not discriminate on the basis of race, religion, color, national origin, gender, sexual orientation, age, marital status, veteran status, or disability status. We are dedicated to providing reasonable accommodations and adjustments to applicants with disabilities throughout the recruitment process. If you require accommodations, please let us know, and we will work with you to meet your needs. Apply now to be part of our world-class team and contribute to the future of computing! Widely considered to be one of the technology world’s most desirable employers, NVIDIA offers highly competitive salaries and a comprehensive benefits package. As you plan your future, see what we can offer to you and your family www.nvidiabenefits.com NVIDIA is the world leader in accelerated computing. NVIDIA pioneered accelerated computing to tackle challenges no one else can solve. Our work in AI and digital twins is transforming the world's largest industries and profoundly impacting society. Learn more about NVIDIA.

Responsibilities

The role involves leading the development of cutting-edge microelectronics packaging for future NVIDIA Networking Business Unit products, collaborating with design teams and world-leading vendors to resolve manufacturing and electrical design issues. Responsibilities also include monitoring production KPIs, leading task forces for production excursions, and establishing quality standards.