IC Packaging Integration Engineer at Apple

Santa Clara, California, United States -

Full Time

Start Date

Immediate

Expiry Date

20 Jan, 26

Salary

0.0

Posted On

22 Oct, 25

Experience

10 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

IC Packaging Development, SoC Package Integration, Architecture Efforts, Advanced Package Solutions, Material Developments, Thermal Reliability, Mechanical Reliability, Signal Integrity, Power Integrity, Testing, Failure Analysis, Package-System Integration, Advanced Packaging Technologies, Problem Solving, Communication Skills, Allegro

Industry

Computers and Electronics Manufacturing

Description

Do you like to work on ground breaking technologies that enable amazing new products? Do you have the attention for details and love for excellence to work towards an extraordinary result? Envision what you could do here! At Apple, we believe new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish! We are looking for versatile and passionate IC Packaging Engineer to join our team! DESCRIPTION • You will be responsible for IC packaging development • Work with cross-functional teams and lead SoC Package integration and architecture efforts • Drive the industry with advanced package solutions, new material developments, and specs MINIMUM QUALIFICATIONS BS and 10+ years of experience in relevant industry experience PREFERRED QUALIFICATIONS MS/PhD and 6+ years of experience in relevant industry. We are looking for someone experienced in the semiconductor packaging and/or system integration. Good understanding of multi-functional packaging areas: package layout and architecture, enabling process technologies, thermal, mechanical, SI/PI, material, component & system level reliability, testing, FA and package-system integration. Specialist in advanced packaging technologies (FOWLP/2.5D/3D): Knowledge and insight to deliver high density / high performance interconnects in various form factor, thermo-mechanical, reliability, and cost constraints. Excellent problem solving with strong physics and fundamentals. Excellent communication skills that enable the candidate to work well with internal cross functional teams and overseas suppliers. Basic knowledge of signal integrity/power integrity. Ability to review schematics, package/PCB layout and designs in Allegro.

Responsibilities

You will be responsible for IC packaging development and will work with cross-functional teams to lead SoC Package integration and architecture efforts. You will drive the industry with advanced package solutions, new material developments, and specifications.