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Intern - ADV. DRAM PI at Micron Technology
Boise, Idaho, United States -
Full Time

Start Date

Immediate

Expiry Date

08 Jan, 26

Salary

0.0

Posted On

10 Oct, 25

Experience

0 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

No

Skills

Process Integration, Materials Science, Semiconductor Device Physics, Project Management, Performance, Manufacturability, 3D DRAM Technology, Circuit Issues

Industry

Semiconductor Manufacturing

Description
Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in artificial intelligence possible. We do it all while committing to integrity, sustainability, and giving back to our communities, because doing so can fuel the very innovation we are pursuing. As a process integration engineer in the 3D DRAM organization, you will join a team of world-class engineers who are working in an industry leading 300mm R&D facility on technology that enables the future of memory scaling. You will focus on performance and manufacturability of Micron's cutting-edge next-generation memories. Areas of concentration will include integration and circuit issues specific to 3D DRAM technology. In addition to a broad basis of process integration knowledge, this position requires a strong background in materials science and semiconductor device physics, along with a creative mindset and effective project management. The role interacts significantly with process development, simulation, characterization, and reliability groups.
Responsibilities
As a process integration engineer, you will focus on the performance and manufacturability of Micron's next-generation memories. You will work on integration and circuit issues specific to 3D DRAM technology.