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Intern - APTD SG Wafer Level Technology at Micron Technology

, , Singapore -

Full Time

Start Date

Immediate

Expiry Date

24 Mar, 26

Salary

0.0

Posted On

24 Dec, 25

Experience

0 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Critical Thinking, Data Analysis, Problem-Solving, Material Science, Chemical Engineering

Industry

Semiconductor Manufacturing

Description

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Summary Support development of High Bandwidth Memory (HBM) technology through metal plating characterization. The intern will design and execute experiments, collect and analyze data, and recommend process targets for different metal stacking combinations and aspect ratios. Collaboration with the chemical lab will be required to establish specific metal concentration analysis. Department APTD Singapore Post Wafer Fabrication Project Title Metal Plating Characterization for Advanced High Bandwidth Memory Technology Development Project Description Design and follow up on experiments for incumbent and alternative metal plating chemistry characterization. Multi-Metal Stack Evaluation: Plate wafers with different stack sequences or other combinations and analyze interface quality, Inter-Metallic Compound(IMC) thickness. Metal Concentration Impact: Study how variations in metal ion concentration influence plating uniformity and stack integrity (e.g %Ag or other metals). Collaborate with the chemical lab for accurate concentration analysis. Collect and analyze experimental data to identify trends and recommend process targets. Scope Explore plating process parameters and metal stack variations impacts on performance. Develop data-driven recommendations for process optimization. Deliverable Comprehensive analysis report with recommended process targets and validated experimental results. Target to achieve plating coplanarity

Responsibilities

The intern will support the development of High Bandwidth Memory (HBM) technology through metal plating characterization, designing and executing experiments, and analyzing data. Collaboration with the chemical lab is required to establish specific metal concentration analysis.