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Intern - APTD SG Wafer Level Technology at Micron Technology

, , Singapore -

Full Time

Start Date

Immediate

Expiry Date

24 Mar, 26

Salary

0.0

Posted On

24 Dec, 25

Experience

0 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Critical Thinking, Data Analysis, Problem-Solving, Metal Plating, Process Optimization, Experiment Design, Collaboration, Concentration Analysis

Industry

Semiconductor Manufacturing

Description

Support development of High Bandwidth Memory (HBM) technology through metal plating characterization. Design and follow up on experiments for incumbent and alternative metal plating chemistry characterization. Collaborate with the chemical lab for accurate concentration analysis. Explore plating process parameters and metal stack variations impacts on performance. Develop data-driven recommendations for process optimization. Deliverable Comprehensive analysis report with recommended process targets and validated experimental results. Target to achieve plating coplanarity

Responsibilities

Support the development of High Bandwidth Memory (HBM) technology through metal plating characterization. Design and follow up on experiments to analyze metal plating chemistry and its impact on performance.