Intern - Design Architect, HBM at Micron Technology

Richardson, Texas, United States -

Full Time

Start Date

Immediate

Expiry Date

08 Jan, 26

Salary

0.0

Posted On

10 Oct, 25

Experience

0 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Cmos Circuit Design, Semiconductor Device Physics, Digital Modeling, Analog Modeling, Simulations, Dram Memory Array Design, High-Speed Clocking, Interface Development, Logic Design, Custom Circuit Design, Power Delivery Optimization, 2.5D Packaging, 3D Packaging, Verilog, FastSpice, Hspice

Industry

Semiconductor Manufacturing

Description

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. For more than 43 years, Micron Technology, Inc. has redefined innovation with the world's most advanced memory and semiconductor technologies. We're an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life. You will be working with HBM Design Architects working on the design & development of next generation HBM DRAM products. You will work with a variety of technical experts across departments to achieve our HBM roadmap goals. You will apply your knowledge of analog/digital circuit design in one or more areas including memory array architect, high-speed interface design, logic & custom circuit design, high-performance computing architectures and 2.5D & 3D package. Successful candidates for this position will have: Experience with CMOS circuit design and good understanding of semiconductor device physics Knowledge and experience in digital (Verilog) and/or analog (FastSpice & Hspice) modeling and simulations Knowledge in one or more areas - DRAM memory array design, high-speed clocking and interface development, logic and custom circuit design, power delivery optimization, CMOS & semiconductor device physics, 2.5D and 3D packaging technologies Good verbal and written communication skills with the ability to effectively synthesize and convey complex technical concepts to other partners and leadership Required Experience: Graduate student preferred

Responsibilities

You will be working with HBM Design Architects on the design and development of next generation HBM DRAM products. You will collaborate with various technical experts across departments to achieve HBM roadmap goals.