Intern – Device and Process Integration Engineer ID1 at Micron Technology
Boise, Idaho, United States -
Full Time


Start Date

Immediate

Expiry Date

06 Jan, 26

Salary

0.0

Posted On

08 Oct, 25

Experience

0 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

No

Skills

Semiconductor Devices, CMOS, Capacitor Knowledge, DRAM, NAND, NOR, Statistical Data Analysis, Semiconductor Process Flow, DRAM Process Flow, Clean Room Experience, Device Characterization Lab Experience, Communication Skills, Self-Motivated

Industry

Semiconductor Manufacturing

Description
Support integration of process modules across various DRAM module loops. Analyze electrical and inline data to identify yield detractors and process anomalies. Collaborate with cross-functional teams (YE, Device, PI, process et al) to drive continuous improvement. Document findings and present updates to engineering and leadership teams. Strong knowledge of semiconductor devices is required. Advanced CMOS or capacitor knowledge is preferred. Basic Knowledge of mainstream memory such as DRAM, NAND, NOR et al. Knowledge of statistical data analysis. Knowledge of semiconductor process flow. Knowledge of DRAM process flow is a plus. Ability do work 6 months full-time as an intern starting in January PhD student in Electrical Engineering, Materials Engineering, Chemical engineering, or Physics. Clean room and/or device characterization lab experience. Good communication skills and self-motivated
Responsibilities
Support integration of process modules across various DRAM module loops and analyze electrical and inline data to identify yield detractors and process anomalies. Collaborate with cross-functional teams to drive continuous improvement and document findings for presentation to engineering and leadership teams.
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