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Intern - HIG HBM PACKAGE PSE at Micron Technology
, , Singapore -
Full Time

Start Date

Immediate

Expiry Date

12 Jan, 26

Salary

0.0

Posted On

14 Oct, 25

Experience

0 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

No

Skills

Phyton Coding, Semiconductor Knowledge, Physics Knowledge

Industry

Semiconductor Manufacturing

Description
Department : Heterogeneous Integration Group High Bandwidth Memory Product System Engineer (HIG HBM PSE ) Project Tittle : HBM Defect library dashboard Project Description : Objectives : To setup HBM defect library by documenting the electrical/physical fail signature of defect of interest. Create standardize tracking dashboard for defect fail mode within the different test flow. Project Scope: Understand the electrical failing signature(s) of the different defect fail mode across the process and how it fails in each test flow. Deliverable: Able to create a user-friendly dashboard to keep track and document all defect fail mode Skillset Require : Phyton coding, semiconductor/physic basic knowledge Course of Interest : MsC in Science (Electrical Engineering), MsC Material Science & Engineering Duration Period : min 6 months
Responsibilities
The intern will set up an HBM defect library by documenting electrical and physical fail signatures of defects. They will also create a standardized tracking dashboard for defect fail modes across different test flows.