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INTERN NAND Process Integration Engineer at Micron Technology

Vimercate, Lombardy, Italy -

Full Time

Start Date

Immediate

Expiry Date

23 Jan, 26

Salary

0.0

Posted On

25 Oct, 25

Experience

0 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

3D NAND Arrays, Mechanical Stress, Reliability Concerns, TCAD, Electrical Simulations, Layout Proposals, Design Rule Definitions, Structural CAD, Benchmarking, Collaboration, Documentation, Modeling Results, Engineering Stakeholders, Physics, Material Sciences, Structural Engineering

Industry

Semiconductor Manufacturing

Description

Develop and refine structural models of 3D NAND arrays to anticipate mechanical stress and reliability concerns. Provide baseline array models to support TCAD-driven electrical simulations (e.g., capacitance, E-field). Analyze layout proposals and contribute to early-stage design rule definitions. Collaborate with structural CAD team, providing input structures at the aim to collect and benchmark mechanical outputs parameters vs option Collaborate with cross-functional teams including TCAD, Process Integration, and Design Engineering. Document modeling results and present findings to engineering stakeholders. Currently pursuing (or graduated) a Master's degree (MSc) in: Physics or Material Sciences Structural Engineering Engineering Physics Electronics Engineering

Responsibilities

Develop and refine structural models of 3D NAND arrays to anticipate mechanical stress and reliability concerns. Collaborate with cross-functional teams including TCAD, Process Integration, and Design Engineering.