Intern - Package/Interposer Design (Summer 2026) at SK hynix America

San Jose, California, United States -

Full Time

Start Date

Immediate

Expiry Date

26 May, 26

Salary

50.0

Posted On

25 Feb, 26

Experience

0 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Package Design, Interposer Design, Semiconductor Packaging, Package Layout Tools, Cadence APD, Autocad, Flip Chip, BGA, LGA, 2.5D Integration, 3D Integration, HBM, Signal Integrity, Power Integrity, Electrical Engineering, Problem-Solving

Industry

Semiconductor Manufacturing

Description

Job Title: Intern, Package/Interposer Design (Summer 2026) Office Location: San Jose, CA Work Model: Onsite Duration: June 2026 - August 2026 At SK hynix America, we're at the forefront of semiconductor innovation, developing advanced memory solutions that power everything from smartphones to data centers. As a global leader in DRAM and NAND flash technologies, we drive the evolution of advancing mobile technology, empowering cloud computing, and pioneering future technologies. Our cutting-edge memory technologies are essential in today's most advanced electronic devices and IT infrastructure, enabling enhanced performance and user experiences across the digital landscape. We're looking for innovative minds to join our mission of shaping the future of technology. At SK hynix America, you'll be part of a team that's pioneering breakthrough memory solutions while maintaining a strong commitment to sustainability. We're not just adapting to technological change – we're driving it, with significant investments in artificial intelligence, machine learning, and eco-friendly solutions and operational practices. As we continue to expand our market presence and push the boundaries of what's possible in semiconductor technology, we invite you to be part of our journey to creating the next generation of memory solutions that will define the future of computing. About the Role: We are offering an exciting opportunity at SK Hynix America for a Package/Interposer design Intern to join our dynamic engineering team. In this position, you will work on advanced semiconductor packaging projects, gaining hands-on experience in Package/Interposer design of advanced packages using package layout tools. You will be introduced to the basics of the advanced package design and manufacturing process flow. Responsibilities: Become familiar with various IC packaging structures and the process steps involved in making the end product. Learn the basics of using package layout tools such as Cadence APD, Autocad etc. Start developing design and layout of advanced semiconductor package including Flip Chip, BGA, LGA, 2.5D/3D heterogeneous integration with High Bandwidth Memory (HBM) Learn to compare Signal Integrity (SI) and Power Integrity (PI) characteristics through design and layout exercise. Qualifications And Education Requirements: Currently pursuing a Master's or PhD's degree in Electrical Engineering or a related field. Strong interest in signal integrity, power integrity fundamentals and its applications in semiconductor packaging. Strong problem-solving and analytical skills. Excellent communication and teamwork abilities, with a desire to collaborate effectively in a multidisciplinary environment Preferred Skills Familiarity with Package layout tools (Cadence Allegro, Xpedition, Autocad or equivalent) Basic understanding of semiconductor packaging concepts and materials is advantageous. Housing Allowance: Eligible interns will receive a housing allowance during their internship. Equal Employment Opportunity: SKHYA is an Equal Employment Opportunity Employer. We provide equal employment opportunities to all qualified applicants and employees, and prohibit discrimination and harassment of any type without regard to race, sex, pregnancy, sexual orientation, religion, age, gender identity, national origin, color, protected veteran or disability status, genetic information or any other status protected under federal, state, or local applicable laws. Compensation: Our compensation reflects the cost of labor across several U.S. geographic markets, and we pay differently based on those defined markets. Pay within the provided range varies by work location and may also depend on job-related skills and experience. Your Recruiter can share more about the specific salary range for the job location during the hiring process. Pay Range $26—$50 USD

Responsibilities

The intern will gain hands-on experience in Package/Interposer design of advanced packages using layout tools and will be introduced to the basics of the advanced package design and manufacturing process flow. Responsibilities include familiarizing oneself with IC packaging structures, learning layout tools, and developing designs for advanced packages like Flip Chip, BGA, and HBM integration.