Intern - TEM at Micron Technology
, , Singapore -
Full Time


Start Date

Immediate

Expiry Date

27 Jan, 26

Salary

0.0

Posted On

29 Oct, 25

Experience

0 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

No

Skills

3D Electron Tomography, Focus Ion Beam, Data Analysis, Materials Characterization, Semiconductor Device Physics, Problem-Solving, Collaboration, Technical Reporting, Nanoscale Analysis, TEM Tools, 3D Reconstruction Software, Innovation, Communication Skills, Continuous Improvement, Technical Presentations, Cross-Functional Collaboration

Industry

Semiconductor Manufacturing

Description
Assist in the preparation of 3D NAND samples for 3D Electron Tomography analysis using Focus Ion Beam (FIB). Perform 3D Electron Tomography experiments using TEM/STEM/EFTEM, including tilt-series acquisition and reconstruction. Analyze tomographic data to extract structural and compositional information at the nanoscale. Collaborate with cross-functional teams including process integration, device engineering, and reliability to support root cause analysis and technology development. Document findings and present results in technical reports and team meetings. Devote to the continuous improvement of lab procedures, ensuring a safe and efficient working environment. Currently pursuing a PhD degree in Materials Science and Engineering, Applied Physics or a related field. Basic understanding of semiconductor device physics and materials characterization techniques. Hands-on experience with various TEM tools, including Nion, TFS, and JEOL. Proficiency in data analysis tools (e.g., DigitalMicrograph, MATLAB, Python) is advantageous. Experience with 3D reconstruction software (e.g., Avizo, IMOD, TomoJ, Inspect3D) is preferred. Strong problem-solving skills with a proven track record of innovation. Excellent communication skills and a collaborative, team-oriented mindset.
Responsibilities
Assist in the preparation of 3D NAND samples for analysis and perform 3D Electron Tomography experiments. Collaborate with cross-functional teams to support root cause analysis and technology development.
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