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Intern - Thermal Modeling & Simulation at Micron Technology

Boise, Idaho, United States -

Full Time

Start Date

Immediate

Expiry Date

24 Mar, 26

Salary

0.0

Posted On

24 Dec, 25

Experience

0 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Thermal Modeling, Simulation Tools, Heat Transfer Principles, Thermal Analysis, Python, AI/ML Concepts, Analytical Skills, Problem-Solving, Communication Skills, Thermal Simulation Tools, Semiconductor Packaging, Advanced Memory Technologies, Hands-On Experience, Innovative Solutions, Research Environment

Industry

Semiconductor Manufacturing

Description

Research and develop thermal modeling techniques coordinated with simulation tools improved by artificial intelligence. Analyze thermal heat transfer challenges in advanced high-performance memory packaging. Propose design or process modifications to reduce thermal hotspots and improve reliability. Collaborate with multi-functional teams to validate solutions and implement improvements. Document findings and contribute to knowledge sharing within the engineering organization. Currently pursuing a Master's or Ph.D. in Mechanical Engineering, Electrical Engineering, Computer Science, or related field. Strong understanding of heat transfer principles and thermal analysis. Proficiency in Python or similar programming languages for simulation and modeling. Familiarity with AI/ML concepts and their application in engineering simulations. Excellent analytical, problem-solving, and communication skills. Experience with thermal simulation tools (e.g., ANSYS, COMSOL, or similar). Knowledge of semiconductor packaging and advanced memory technologies. Hands-on experience applying AI/ML to engineering problems. Ability to work independently and deliver innovative solutions in a research environment.

Responsibilities

Research and develop thermal modeling techniques coordinated with simulation tools improved by artificial intelligence. Collaborate with multi-functional teams to validate solutions and implement improvements.