SHAPE THE FUTURE WITH NXP – ARE YOU READY TO JOIN US?

NXP Semiconductors is seeking a highly motivated Electrical Engineering student to join our Package Innovation (PI) team in Nijmegen, the Netherlands. This internship offers a unique opportunity to contribute to cutting-edge semiconductor packaging technologies through electrical modeling and RF lab measurements. You’ll be part of a dynamic team driving digital transformation, with ample room for innovation, personal development, and mentorship.

• Analyze existing and emerging package technologies to support new product concepts.
• Contribute to package development by addressing electrical requirements and documentation.
• Perform electrical modeling and simulation of proposed package solutions.
• Design test structures and develop techniques for characterizing electrical properties of current and future packaging materials.
• Conduct RF measurements in the Nijmegen lab on test structures and dielectric materials.
• Apply post-processing techniques for on-wafer characterization and de-embedding.
• Utilize measurement techniques for material characterization.
• Run optiSLang simulations and validate results against lab measurements.
• Investigate fast-cycle manufacturing processes for on-wafer techniques (design to post-processing within days).
• Analyze the impact of surface roughness and de-embedding accuracy at frequencies above 100 GHz.