The goal of the iPhone Touch Sensing Technology team is to enable the world’s best user experiences through innovative sensing solutions. The team designs, develops, and delivers high-precision, low-latency MultiTouch solutions that are the gold standard in the smartphone/mobile industries. New challenges arise every day that require innovation across several technical fields, including Electrical Engineering, Manufacturing process, Physics, and Algorithms. Come join us in delivering technology from proof-of-concept through ultra-high-volume production! Our team features a collaborative and hands-on environment that cultivates engineering excellence and creativity.

DESCRIPTION

You will play a key role in designing, developing, integrating, and launching next-generation touch sensing technologies. Your responsibilities will include: - Perform design feasibility studies and analyses based on sophisticated module requirements and system constraints. - Collaborate with silicon design team, DFM team, system team, and external suppliers to develop optimized module/system level design solutions for our touch sensing technology. - Define Module test and feature validation across all supply chain nodes. Drive Module/System-level failure analysis, root cause diagnosis, and corrective action validation. - Engage partner teams to address critical issues through multiple engineering development stages to ensure a smooth product delivery. - Business travel may be required to support product development.

MINIMUM QUALIFICATIONS

• Strong electrical engineering background in board-level analog and mixed-signal design.
• Circuit and FEA simulation experience (LCR extraction, signal integrity, electromagnetic coupling, etc.).
• Hands-on experience with module/system level integration, including architecture scoping, characterization, design down-selection, and validation.
• Experience with creating engineering design, requirement, and specification documents.
• Proficiency in MATLAB and Python scripting tools.
• Demonstrated ownership and ability to work with multi-functional teams in a dynamic work environment.
• Ability to thrive in ambiguity, independently converge technical issues, and align efforts across teams.
• Excellent written and verbal communication skills and solid teamwork.
• BS and a minimum of 3 years relevant industry experience.

PREFERRED QUALIFICATIONS

• Experience with high volume manufacturing of Flexible Printed Circuit Boards or micro fabrication process development is a plus.
• Experience with statistical analysis of production data (familiarity with JMP is a plus).
• Schematic design and layout experience (SPICE or Cadence experience a plus).

Please refer the Job description for details