[July 2026 Onwards Intake] Internship - Technology Development Engineering at Sandisk

Batu Kawan, Penang, Malaysia -

Full Time

Start Date

Immediate

Expiry Date

15 Jan, 26

Salary

0.0

Posted On

17 Oct, 25

Experience

0 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Failure Analysis, Memory Product Technology, Semiconductor Assembly, SMT Assembly Process, Wafer Fab Process, Technical Reporting, 3D X-Ray, TDR, SEM/EDX, Curve Tracer Analysis, CSAM, Communication Skills, Teamwork, English Proficiency

Industry

Semiconductor Manufacturing

Description

Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape. Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality. Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward. Job Description ESSENTIAL DUTIES AND RESPONSIBILITIES: Perform package and device analysis on new product qualification, assembly test failure from production. Define the FA flow for each FA case. Generate technical FA report and assist process engineer for root-causing of defect/s. SME on equipment and maintain the FA tracking. Qualifications REQUIRED: Bachelor Degree and/or Master in Electrical/ Electronic/Material Science/Chemistry. Familiar with memory product technology and structure. Familiar with semiconductor and SMT assembly process and technology. Familiar with wafer fab process. Understand memory product test process and methodology. Skillful in performing Failure Analysis in SMT, package and device analysis failure. SKILLS: Strong technical knowledge on 3D X-ray, TDR, SEM/EDX, curve tracer analysis and CSAM. Good communication and presentation skills. Good teamwork spirit. Fluent in English speaking, reading and technical FA report writing. Additional Information Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution. Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at [email protected] to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying. NOTICE TO CANDIDATES: Sandisk has received reports of scams where a payment is requested on Sandisk’s behalf as a condition for receiving an offer of employment. Please be aware that Sandisk and its subsidiaries will never request payment as a condition for applying for a position or receiving an offer of employment. Should you encounter any such requests, please report it immediately to Sandisk Ethics Helpline or email [email protected].

Responsibilities

Perform package and device analysis on new product qualification and assembly test failures. Generate technical failure analysis reports and assist process engineers in root-cause analysis of defects.