Start Date
Immediate
Expiry Date
16 Apr, 26
Salary
0.0
Posted On
16 Jan, 26
Experience
10 year(s) or above
Remote Job
Yes
Telecommute
Yes
Sponsor Visa
No
Skills
Project Management, Leadership, Stakeholder Management, Communication, Semiconductor Packaging, Process Integration, Technology Development, Hybrid Bonding, CoWoS, Chiplet Integration, Simulation Modeling, Yield Enhancement, Defectivity Analysis, Continuous Improvement, PMO Methodologies, KPI Development
Industry
Semiconductor Manufacturing