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Lead Principal Engineer Package Technology at Infineon Technologies AG Australia

Malacca City, Malacca, Malaysia -

Full Time

Start Date

Immediate

Expiry Date

12 Feb, 26

Salary

0.0

Posted On

14 Nov, 25

Experience

10 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Cost Estimation, Cost Indication, Package Design, Semiconductor Packaging, Assembly, Test, Process Engineering, Equipment Engineering, Failure Analysis, Reliability Engineering, Analytical Skills, Problem Solving Skills

Industry

Semiconductor Manufacturing

Description

Coordinate the package Cost Estimation (A1-A3) and Cost Indication (A3). Support pre development & project definition stage, and continue to be package design expert throughout project phase. Bachelor's Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics). 10 years of relevant working experience in IC/semiconductor environment. Semiconductor Packaging, Assembly and Test. Process and Equipment Engineering knowledge. Failure Analysis and Reliability Engineering. Analytical and Problem Solving Skills. We are on a journey to create the best Infineon for everyone. This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills. Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.

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Responsibilities

Coordinate the package cost estimation and cost indication. Support the pre-development and project definition stage, continuing as a package design expert throughout the project phase.