Lead Signal Integrity Engineer at Advanced Micro Devices, Inc

Hyderabad, Telangana, India -

Full Time

Start Date

Immediate

Expiry Date

16 Aug, 26

Salary

0.0

Posted On

18 May, 26

Experience

10 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Signal Integrity Analysis, High-Speed SerDes, PCB Design, EM Analysis, IBIS-AMI, SPICE, Keysight ADS, Cadence Sigrity, Ansys HFSS, MATLAB, Python, TDR, VNA, High-Speed Oscilloscopes, Channel Simulation, Power Integrity

Industry

Semiconductor Manufacturing

Description

WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career. THE ROLE: As a Staff Signal Integrity Engineer at AECG, AMD, you will be responsible for ensuring that AMD’s next-generation products deliver industry-leading reliability, performance, and efficiency. This role involves analyzing, modeling and validating the complex interconnects of high-speed Serializer/De-serializer (SerDes) channels @56/64/112/128/224+ Gbps, High speed memories like LPDDR4/5x/6, DDR5, PCIe Gen 5/6 etc., and 400/800/1600Gbps Ethernet links. You will be providing guidelines to board layout teams based on SI and Power simulations and for high-speed structures. THE PERSON: In this role, you will closely collaborate with Board HW designers, HW architects, IC packaging team, PCB team, and external partners/suppliers to ensure first time success of the system/board products. KEY RESPONSIBILITIES: Model and simulate the end-to-end high-speed channels including transceivers, IC package, PCB and cross-boards connectors/cables Utilize industry-standard tools and methodologies to perform a variety of time/frequency domain signal integrity analysis (IBIS-AMI, SPICE, full-wave EM analysis, etc) Identify the link quality such as loss, reflection and crosstalk, and resolve the issues Simulations for HBM/DDR6/5, LPDDR6/5, LPCAM, DIMMs; PCIE Gen5/6/7 and other high-speed buses Conduct channel-simulations to optimize Eye Diagram, Bit Error Rate (BER) and Signal-Noise-Ratio (SNR) for high-speed signaling in a complex system. Interpret the simulation results to provide the design guidelines on board materials, stack-up, transmission line routings, component placement and layout optimization Review PCB layout and board material/stack-up, identify the potential signal integrity and power integrity issues, and propose the solutions Support lab validation and debugging to correlate with the simulation data Collaborate with cross-functional teams to drive product development while keeping projects on schedule and within scope. PREFERRED EXPERIENCE: Strong experience in high-speed signal integrity engineering Strong expertise in high-speed architecture, interconnects and PCB/package design Knowledge of high-speed interfaces (PCIe, Ethernet, DDR, etc.) Proficiency in SI simulation tools (Keysight ADS, Cadence Sigrity, Ansys HFSS) Familiarity with MATLAB or Python for data analysis and automation Hands-on experience with lab testing tools (TDR, VNA, high-speed oscilloscopes) Excellent problem-solving and cross-functional collaboration skills ACADEMIC CREDENTIALS: BS/MS or PhD degree in Electrical Engineering, Computer Engineering, or related field with 8+Yrs of exp #LI-SR4 Benefits offered are described: AMD benefits at a glance. AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here. This posting is for an existing vacancy.

Responsibilities

Responsible for modeling, simulating, and validating high-speed interconnects and channels to ensure reliability and performance of next-generation products. Provides design guidelines for board layout, materials, and stack-up while collaborating with cross-functional hardware teams.