LINK application engineer III - (E3) at Applied Materials
Hsinchu, , Taiwan -
Full Time


Start Date

Immediate

Expiry Date

12 Apr, 26

Salary

0.0

Posted On

12 Jan, 26

Experience

2 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

No

Skills

Electrical Engineering, Electronics Engineering, Mechanical Engineering, Computer Science, Semiconductor Design, Design Verification, Fabrication, Technical Support, Training, Product Development, High-NA DUV Imaging, SEM, Light-Matter Interaction, Analytical Skills, Problem Solving, Communication Skills

Industry

Semiconductor Manufacturing

Description
Who We Are Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips - the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world - like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world. What We Offer Location: Hsinchu,TWN You'll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more. At Applied Materials, we care about the health and wellbeing of our employees. We're committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits. LINK Application engineers are supposed to maximize the performance of our new defect metrology products through a deep and thorough understanding of use-cases in close technical collaboration with leading-edge chip manufacturing customers. Build and maintain strong relationships with customers, including regular communication, feedback and follow-up to ensure customer satisfaction and success. Work closely with internal Product teams including R&D, marketing and internal Account stakeholders to ensure alignment, effective communication and customer engagement. At a higher expertise level, they also contribute to product development roadmap through spec definition and performance validation. They also contribute to SW Application Alpha/Beta phase of qualification in-house and at customer site. The desired qualifications of this position are Master's / Bachelor's degree in Electrical/Electronics Engineering, Mechanical Engineering, Computer Science Engineering or in a related field. 2 to 5 yrs experience in Semiconductor Design, Design Verification, Fabrication or in related field, with focus on technical support, training and/or product development. Sound fundamentals of high-NA DUV imaging/SEM and light-matter/electron-matter interaction Open to on average 50% travel to leading semiconductor chip manufacturing fabs overseas Lab/fab hands-on experience in semiconductor fabrication with layer-wise detailed knowledge of material, process tech and defectivity Detail oriented with strong analytical, problem solving and communication skills Ability to work in a team, and ability to work independently Additional Information Time Type: Full time Employee Type: Assignee / Regular Travel: Yes, 50% of the Time Relocation Eligible: No Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.

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Responsibilities
LINK Application Engineers maximize the performance of defect metrology products through collaboration with chip manufacturing customers. They build strong customer relationships and contribute to product development and qualification phases.
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