Manager, Process Module Engineering (Packaging Engineering) at Sandisk

Batu Kawan, Penang, Malaysia -

Full Time

Start Date

Immediate

Expiry Date

07 Apr, 26

Salary

0.0

Posted On

07 Jan, 26

Experience

10 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Process Development, Materials Development, Technology Roadmap, Packaging Technology, Cross-Functional Collaboration, Problem-Solving Methodology, Yield Analysis, Advanced Process Control, Digital Transformation, Materials Characterization, IC Packaging Processes, High-Density Die Stacking, Engineering Investigation, Structured R&D Methodology, Lab Characterization, Technical Analysis

Industry

Semiconductor Manufacturing

Description

Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape. Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality. Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward. Job Description ESSENTIAL DUTIES AND RESPONSIBILITIES: To lead Die Attach Process Module Engineering team for Process/Materials Development, Qualification and Transfer to HVM. Responsible for Key technology development & tech-staging to drive and enable product, process and materials technology roadmap solutions for next generation memory storage packaging solutions. To lead or co-lead Development JET (Joint Engineering Team) with global cross-functional teams incl. process, materials, CPI, package design, thermal-mechanical simulation, quality and other related stakeholders. To build and nurture strong process development team related to high density ultra-thin die attach process, material and packaging architecture - emphasizing deep engineering fundamental, structured methodology and DOE planning / execution / analysis. To lead studies related to in-depth fundamental investigation/characterization in packaging development. Ensure strong materials to process/design compatibility to meet stringent quality and reliability requirements from customers and industry standards. To co-drive material technology roadmap definition and path finding/development programs with global cross-functional teams including product design, process engineering, lab characterization teams and test engineering in delivering Best-In-Class and Industry leading products. To lead and drive collaboration with strategic equipment & material suppliers, service providers, academia, industry consortium in collaboration projects or co-development activities. To drive breakthrough in product packaging materials and process. To support IR5.0 Digital Transformation for Packaging process e.g. Process Digital Twins, Advanced Process Control (APC), Fault Detection Control (FDC), fundamental lab characterization and design rules definition. Drive yield analysis activities in process characterization and qualification phases. To drive in-depth fundamental engineering investigation culture and problem-solving methodology in delivering robust packaging technology. Qualifications REQUIRED: Master Degree or PhD in Materials Engineering / Mechanical Engineering / Physics / Micro-electronics. Strong hands-on experience Packaging technology development experience and well-versed with structured R&D methodology. Strong experience in driving technology roadmap and technology innovation to achieve best-in-class advanced packaging technology solutions. Minimum 10 years of Semiconductor Packaging Process with in-depth knowledge on IC packaging processes, high-density / ultra-thin die stacking technology development hands-on & indepth exposure. Proven capabilities to navigate through highly dynamic and fast-paced project requirements and interdependencies. PREFERRED: Experience in application of AI / ML-augmented engineering development and innovation and analytics. Proven experience with in-depth engagement in materials and process technology fundamentals, with materials characterization lab either internally, suppliers or other 3rd party. Personal hands-on experience on advanced lab instruments e.g. SEM/FIB, EDX/FTIR, Shadow Moire, will be added advantage. SKILLS: Ability to lead complex technical investigation and analysis with global cross-functional teams. Ability to work with internal development / HVM teams and suppliers on process qualification and co-development. Ability to lead complex technical investigation and analysis with global cross-functional teams. Additional Information Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution. Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at [email protected] to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying. NOTICE TO CANDIDATES: Sandisk has received reports of scams where a payment is requested on Sandisk’s behalf as a condition for receiving an offer of employment. Please be aware that Sandisk and its subsidiaries will never request payment as a condition for applying for a position or receiving an offer of employment. Should you encounter any such requests, please report it immediately to Sandisk Ethics Helpline or email [email protected]. Job Type (exemption status): Exempt position - Please see related compensation & benefits details below Business Function: Packaging Engineering Work Location: Penang SDSM Office--LOC_SNDK_Seberang Perai Office

Responsibilities

Lead the Die Attach Process Module Engineering team for process and materials development, qualification, and transfer to high-volume manufacturing. Drive technology development and collaboration with global teams to deliver advanced packaging solutions.