Manufacture System Design Engineer at NVIDIA
Shanghai, Shanghai, China -
Full Time


Start Date

Immediate

Expiry Date

23 May, 26

Salary

0.0

Posted On

23 Feb, 26

Experience

10 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

No

Skills

Power Roadmap, Thermal Roadmap, Silicon To Sim Correlation, Yield Projection Modelling, Dppm Projection Modelling, System Features Design, Package Technologies, Process Technologies, Test Flow, Factory Requirements, Board Level Test Programs, Bin Split, Test Engineering, Operations Teams, Binning Methods, Data Analysis

Industry

Computer Hardware Manufacturing

Description
NVIDIA is the industry leader in high performance computing, gaming and AI. Our GPUs and SOCs give outstanding performance and efficiency, revolutionizing myriad fields. We revolutionized the AI world by inventing CUDA. And we are just getting started. Silicon Co-Design Group (SCG) is a wide-ranging, multi-functional team at NVIDIA. We sit at the crossroads of design, architecture, marketing and productization. Our involvement begins at the arch stage and extends to defining final products. We architect and deliver innovative solutions for various markets like Gaming, Datacenter, Servers, Automotive and Embedded. We are fast-paced, multifaceted, share a sense of humor and collaborate extensively to push the boundaries of what is possible. We do all of this with an eye on making ground-breaking impacts in the markets we serve. If this sounds like something you want to do, read on. As part of the Silicon Solutions team at NVIDIA, you will be responsible for creating new testability features and validation methodologies to optimize NVIDIA's chips into groundbreaking consumer, professional, server, mobile, and automotive solutions. What you will be doing: Co-design manufacture power/thermal roadmap with product targets: Silicon to Sim correlation, Yield/DPPM projection modelling Design on-die system/product features to improve power/thermal Work out product impact of new package or chip process technologies Envision highly manufacturable test flow and factory requirements to create optimized manufacturing strategies for quality/performance. Build system, infrastructure and flow to monitor board level test programs to ensure alignment to specifications that affect bin split, yield, and power. Partner with test engineering and operations teams to implementing efficient manufacturable test solutions. What we need to see: MS with 8+ years of experience in EE, CE, CS, Systems Engineering, or similar and experience in a related hardware engineering position or equivalent experience. Rich experience at manufacturing, and production testing of chips, boards, and systems. Knowledgeable at DPPM optimization, test coverage design to meet production requirements and manufacturing strategies for quality/performance optimization. Understand DPPM needs and plan flow through entire screening process. Excellent problem solving, collaborative, and interpersonal skills. Deep understanding of product binning methods, optimization techniques, methods, trade-off analysis and tools for data analysis and statistics. Familiarity with with ATE/SLT/BLT Ways to stand out from the crowd: Familiarity with Test Design and DPPM optimization. Familiarity with statistical methods and tools for data analysis A "go-getter, can get it done" attitude and independent 'out-of-box' thinking. NVIDIA is widely considered to be one of the technology world’s most desirable employers. If you're creative and ambitious, we want to hear from you! NVIDIA is the world leader in accelerated computing. NVIDIA pioneered accelerated computing to tackle challenges no one else can solve. Our work in AI and digital twins is transforming the world's largest industries and profoundly impacting society. Learn more about NVIDIA.
Responsibilities
The engineer will be responsible for co-designing the manufacture power and thermal roadmap aligned with product targets, including correlation and projection modeling. Key duties involve designing on-die features to manage power/thermal, assessing the impact of new technologies, and developing manufacturable test flows and factory requirements.
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