Mechanical Engineer – SoC to Rack Integration at Servant

Tel Aviv, Tel-Aviv District, Israel -

Full Time

Start Date

Immediate

Expiry Date

01 Aug, 26

Salary

0.0

Posted On

03 May, 26

Experience

10 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Mechanical Engineering, HPC, AI Hardware, Datacenter Systems, Liquid Cooling, Thermal Simulation, CFD, FEA, Metal Fabrication, High-Volume Manufacturing, Structural Analysis, Vibration Analysis, Power Delivery, System Integration, Design for Cost

Industry

Software Development

Description

We are seeking a Principal Mechanical Engineer to lead the hardware definition of our next-generation AI infrastructure. This is a high-impact leadership role where you will serve as the primary technical authority for the physical architecture of advanced server platforms. You will bridge the critical gap between ultra-high-power silicon packaging, liquid-cooled node design, and massive-scale Rack deployments. Key Responsibilities Blade & Chassis Design: Lead the end-to-end mechanical definition of server blades, high-density chassis, and rack-level enclosures. Structural Hardware: Architect the integration of sliding rails, blind-mate connectors, precision standoffs, and high-load Extraction Handles. Power & Interconnects: Define mechanical paths for ultra-high-density power delivery (Busbars) and complex cable management. Cold Plate & Fluid Management: Review liquid cooling management by providing mechanical integration feedback on manifold distribution and QD/leak-mitigation system compatibility. Thermal Simulation & Strategy: Contribute mechanical design inputs to balance hybrid air/liquid cooling solutions. Simulation: Drive thermal strategy for 1kW+ nodes using CFD to balance hybrid air/liquid cooling. HVM Mastery: Optimize designs for high-volume manufacturing using Precision Milling, Die Casting, and Complex Sheet Metal fabrication. Environmental Ruggedization: Ensure system integrity against Transportation Shock & Vibration and extreme Thermal/Humidity cycling. Total Lifecycle Design: Implement Design for Cost (DfC) and Easy Assembly (DFA) to ensure seamless serviceability and global deployment. Requirements Required Qualifications Education: B.S. or M.S. in Mechanical Engineering. Experience: 12+ years in high-performance compute (HPC), AI hardware, or datacenter systems. Architectural Pedigree: A proven track record of owning at least one full product lifecycle—from blank-page concept through High-Volume Manufacturing (HVM). Manufacturing Mastery: Expert-level understanding of metal fabrication (Milling, Casting, Sheet Metal) and how these processes impact thermal performance and structural integrity. Liquid Cooling Expertise: Technical knowledge of fluid dynamics, wetted material compatibility, and the mechanical nuances of "Drip-Free" connector integration. Simulation Proficiency: Expert user of FEA tools for structural and vibration analysis. Influence: Ability to drive technical alignment across silicon, power, and optical engineering teams. Preferred Qualifications Direct experience with AI/GPU-based architectures and ultra-high-density power delivery Deep familiarity with Open Compute Project (OCP) or ORV3 standards. Experience with blind-mate liquid and power interfaces.

Responsibilities

Lead the end-to-end mechanical definition and structural architecture of high-density server blades, chassis, and rack-level enclosures for AI infrastructure. Drive thermal strategy, liquid cooling integration, and high-volume manufacturing optimization to ensure system integrity and serviceability.