Mechanical Technical Lead Engineer at Lam Research

Bengaluru, karnataka, India -

Full Time

Start Date

Immediate

Expiry Date

12 Feb, 26

Salary

0.0

Posted On

14 Nov, 25

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Materials Science, Mechanical Engineering, Chemistry, Thermoplastic Materials, Thermoset Plastic Materials, Fabrication Processes, Characterization Methods, Analytical Methods, Non-Destructive Testing, Optical Microscopy, Electron Microscopy, Material Analysis, Failure Analysis, 3D CAD Tools, Communication Skills, Problem-Solving Skills

Industry

Semiconductor Manufacturing

Description

Collaborate with cross-functional teams to drive innovation and improve material performance in semiconductor applications. Stay updated with the latest advancements in materials science and semiconductor technologies to ensure cutting-edge solutions. Develop and implement best practices for material selection, testing, and analysis to enhance product reliability and performance. Ensure compliance with industry standards and regulations related to material usage and testing in semiconductor applications. Proven track record of research and development in materials science, particularly in the semiconductor industry. Strong communication skills to effectively convey technical information to non-technical stakeholders. Ability to work independently and as part of a team in a fast-paced, dynamic environment Bachelor's in mechanical/Materials Engineering with minimum 5 to 8 years of relevant experience. Master's in mechanical/Materials Engineering with minimum 3 to 5 years of relevant experience. Experience in Materials Science, Mechanical Engineering, Chemistry, or a relevant discipline, with a robust understanding of materials used in deposition groups, cleaning processes, and optoelectronic device packaging, particularly plastics. Demonstrate experience with thermoplastic and thermoset plastic materials, including their fabrication processes, characterization, and analytical methods. Possess an in-depth understanding of semiconductor IC, IC package, and board fabrication/assembly processes, with a focus on material analysis. Conduct deep-dive material analysis using techniques such as EDX, XRD, AFM, GC-MS, and similar methods to identify material composition. Have hands-on experience in non-destructive testing (NDT), physical sample preparation, optical and electron microscopy, and material analysis for plastics. Summarize failure analysis findings in comprehensive reports and effectively communicate results with stakeholders, customers, and suppliers. Exhibit strong analytical and problem-solving skills to evaluate root causes and propose effective solutions. Progress towards becoming a key technical expert in materials engineering, contributing to sustainable transit solutions and advancing leadership in cross-functional projects. Identify technology development opportunities for growth and investment. Experience in Semiconductor Wafer Fab Equipment (WFE) domain (Good to have) Excellent communication, both written and verbal, and technical presentation skills. Highly proficient in 3D CAD tools such as CREO, Siemens NX, ProE, SolidWorks, and others. Hands-on experimental and design background coupled with solid engineering skills.

Responsibilities

Collaborate with cross-functional teams to drive innovation and improve material performance in semiconductor applications. Develop and implement best practices for material selection, testing, and analysis to enhance product reliability and performance.