Memory Yield Engineer, Staff at Qualcomm Technologies Inc Turkey

Hsinchu, , Taiwan -

Full Time

Start Date

Immediate

Expiry Date

22 Feb, 26

Salary

0.0

Posted On

24 Nov, 25

Experience

10 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Yield Analysis, Failure Analysis, Statistical Analysis, DRAM Processes, Process Monitoring, Cross-Functional Collaboration, Root Cause Analysis, Memory Repair Schemes, Device Physics, Test Flow Optimization, Memory Process Integration, Design Verification, Test Patterns, Multitasking, Communication Skills, Interpersonal Skills

Industry

Telecommunications

Description

Company: Qualcomm Semiconductor Limited Job Area: Engineering Group, Engineering Group > ASICS Engineering General Summary: Qualcomm is seeking a skilled and proactive Memory Yield Analysis & Improvement Engineer to drive yield optimization for advanced 3D SOC + memory products. This role serves as a critical engineering interface between Qualcomm and memory suppliers, ensuring product requirements are met through rigorous yield analysis, process monitoring, and collaborative problem-solving. Key Responsibilities Yield Monitoring & Analysis Track fab in-line/WAT measurement data to ensure process stability and compliance with specifications. Perform statistical wafer/package-level test data analysis, applying memory repair schemes and correlating fab in-line/WAT data. Failure Analysis & Corrective Action Conduct root cause analysis using fab process history and test results. Drive corrective actions across fab process, wafer test, package test, and design levels to address yield loss. Support failure analysis during SOC + memory system-level characterization and reliability qualification tests. Cross-Functional Collaboration Work closely with fab process teams, test teams, and design engineers from both Qualcomm and memory suppliers. Coordinate test flow/hardware setup and ensure smooth integration across teams. Production Yield Improvement Lead yield optimization efforts post-qualification through fab process/test tuning. Support failure analysis for customer return samples. Required Skills & Experience Minimum 7 years in DRAM wafer yield analysis and improvement engineering. Strong knowledge of DRAM processes, fab defect control, in-line/WAT/AC/DC measurement data analysis, and failure analysis. Experience in DRAM product qualification and repair schemes for yield improvement. Ability to define fab process monitoring specs and wafer/package level test conditions for mature yield achievement. Familiarity with DRAM package-level yield improvement, memory process integration, device physics, design verification, and test patterns. Bonus Skills: Flash memory yield improvement experience. Broader knowledge in device physics, design, 3D wafer bonding, and test flow optimization to minimize memory fail in field. Education Requirements Min Bachelor’s degree in Electrical Engineering (or equivalent engineering) required. Master’s or PhD in Electrical Engineering preferred. Additional Requirements Strong multitasking ability and proactive leadership in supplier engagement. Excellent written and verbal communication skills in English. Strong interpersonal skills for effective teamwork. Willingness to travel occasionally to supplier sites. Commitment to continuous learning in new memory engineering domains. Minimum Qualifications: • Bachelor's degree in Science, Engineering, or related field and 4+ years of ASIC design, verification, validation, integration, or related work experience. OR Master's degree in Science, Engineering, or related field and 3+ years of ASIC design, verification, validation, integration, or related work experience. OR PhD in Science, Engineering, or related field and 2+ years of ASIC design, verification, validation, integration, or related work experience. Applicants: Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries). Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law. To all Staffing and Recruiting Agencies: Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications. If you would like more information about this role, please contact Qualcomm Careers.

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Responsibilities

The Memory Yield Engineer will drive yield optimization for advanced 3D SOC + memory products through rigorous yield analysis and process monitoring. This role involves collaboration with memory suppliers and cross-functional teams to ensure product requirements are met and yield loss is addressed.