SUMMARY

As an Engineering and Physical Science professional, you will use your skills to create the systems and tools that will be used to enhance the operation of intelligence. You will advise, administer and perform scientific projects, such as planning, designing, and constructing specialized equipment, and ensuring adherence to sound engineering and scientific standards and principles. The NSA offers multiple areas of focus for facilities engineers.

INDIVIDUALS WITH DISABILITIES

Individuals who are eligible under Schedule A.

QUALIFICATIONS

The qualifications listed are the minimum acceptable to be considered for the position.
For all 3 types of Microelectronics Engineers, the degree must be in Engineering, Physics, or Materials Science from an accredited college or university, or a relevant professional technical field (for example, microelectronics, semiconductor, chemistry, architecture, computer science, mathematics, hydrology, geology)

For all of the above degrees, if program is not ABET EAC accredited, it must include specified coursework.*

• Specified coursework includes courses in differential and integral calculus and 5 of the following 18 areas: (a) statics or dynamics, (b) strength of materials/stress-strain relationships, (c) fluid mechanics, hydraulics, (d) thermodynamics, (e) electromagnetic fields, (f) nature and properties of materials/relating particle and aggregate structure to properties, (g) solid state electronics, (h) microprocessor applications, (i) computer systems, (j) signal processing, (k) digital design, (l) systems and control theory, (m) circuits or generalized circuits, (n) communication systems, (o) power systems, (p) computer networks, (q) software development, (r) Any other comparable area of fundamental engineering science or physics, such as optics, heat transfer, or soil mechanics.

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EDUCATION

The qualifications listed are the minimum acceptable to be considered for the position.
For all 3 types of Microelectronics Engineers, the degree must be in Engineering, Physics, or Materials Science from an accredited college or university, or a relevant professional technical field (for example, microelectronics, semiconductor, chemistry, architecture, computer science, mathematics, hydrology, geology)

For all of the above degrees, if program is not ABET EAC accredited, it must include specified coursework.*

• Specified coursework includes courses in differential and integral calculus and 5 of the following 18 areas: (a) statics or dynamics, (b) strength of materials/stress-strain relationships, (c) fluid mechanics, hydraulics, (d) thermodynamics, (e) electromagnetic fields, (f) nature and properties of materials/relating particle and aggregate structure to properties, (g) solid state electronics, (h) microprocessor applications, (i) computer systems, (j) signal processing, (k) digital design, (l) systems and control theory, (m) circuits or generalized circuits, (n) communication systems, (o) power systems, (p) computer networks, (q) software development, (r) Any other comparable area of fundamental engineering science or physics, such as optics, heat transfer, or soil mechanics.

IF YOU ARE RELYING ON YOUR EDUCATION TO MEET QUALIFICATION REQUIREMENTS:

Education must be accredited by an accrediting institution recognized by the U.S. Department of Education in order for it to be credited towards qualifications. Therefore, provide only the attendance and/or degrees from schools accredited by accrediting institutions recognized by the U.S. Department of Education.
Failure to provide all of the required information as stated in this vacancy announcement may result in an ineligible rating or may affect the overall rating.

With the ever-increasing technological complexities in the world of Microelectronics, we need talented Microelectronics Engineers to be part of our team designing, assembling, testing, and qualifying the next generation of electronics hardware in support of our mission. Our goal is to provide microelectronics services of the highest quality to ensure the success of the Agency’s mission.
Microelectronics Engineers utilize electrical, computer, mechanical, and materials engineering knowledge and skills to design, assemble, test, analyze and qualify the next generation of electronics hardware in support of the NSA mission.
The National Security Agency (NSA) currently has opportunities for three types of Microelectronics positions: Microelectronics Package Design Engineer, Microelectronics Process Engineer, and Microelectronics Technology Engineer.

1. A Microelectronics Package Design Engineer is focused on developing advanced microelectronics systems through the design of custom multichip modules (MCM), printed circuit board (PCB), high density redistribution layers, 3D multi-layer integrated technologies and/or system enclosures. Areas of responsibility can also include:

• Knowledge of Application Specific Integrated Circuit (ASIC) and Field Programmable Gate Array (FPGA) design
• Knowledge of Register Transfer Level (RTL) design including Verilog and VHDL
• Knowledge of Digital/Analog Logic design/simulation, functional verification, Design For Test (DFT), testability analysis
• Understanding and development of assembly specifications in accordance with industry standards
• Understanding and application of Signal Integrity (SI)/Power Integrity (PI)/Electro-Magnetic Integrity (EMI) Analysis methodologies for design
• Conduct research including studies, experiments, and investigations on new or alternate methodologies
• Enhance process design and development to support advanced assembly techniques such as Three Dimensional Interconnect (3DI) and Printed Electronics

1. A Microelectronics Process Engineer is focused on assembly and fabrication of advanced microelectronics systems such as custom multichip modules (MCM), printed circuit board (PCB), high density redistribution layers, 3D multi-layer integrated technologies and/or system enclosures. Areas of responsibility can also include:

• Participate in assembly and fabrication process improvement efforts
• Conduct research including studies, experiments, and investigations on new or alternate methodologies, fabrication, and/or assembly equipment
• Enhance process and mature development of advanced assembly techniques such as Three Dimensional Interconnect (3DI) and Printed Electronics

1. A Microelectronics Technology Engineer is focused on the test, failure, and physical analysis of advanced microelectronics systems such as integrated circuits, custom multichip modules (MCM), printed circuit board (PCB), high density redistribution layers, 3D multi-layer integrated technologies, and/or system enclosures. Areas of responsibility can also include:

• Conduct environmental and reliability tests
• High-pin-count Integrated Circuit (IC) design and operation validation
• Parametric testing
• Accelerated testing / qualification / screening
• Develop test plans according to industry and military specifications
• Design and develop test platforms
• Support quality assurance efforts for developed and fielded systems
• Disassembly and sample preparation for physical analysis of ICs for failure analysis
• Perform scanning electron microscopy (SEM), low energy electrons microscopy (LEEM), and/or atomic force microscopy (AFM)

When submitting your application, please ensure that you fully populate all sections of the resume tool with all relevant skills, experience, and education, as the resume entered into the tool will be the primary resume used to evaluate your application.Please do NOT populate the resume tool with - see resume. Please attach an unofficial copy of your transcripts from all schools attended when applying for this position. Providing a copy of your transcripts is especially critical to ensure the position’s coursework obligations have been met.