MTS, Advanced Packaging Integration Engineering at Micron Technology

, , Singapore -

Full Time

Start Date

Immediate

Expiry Date

09 Mar, 26

Salary

0.0

Posted On

09 Dec, 25

Experience

10 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Advanced Packaging Technologies, Project Management, Collaboration, Communication, Safety Compliance, Process Integration, Statistical Analysis, Data Analytics, Python, R, SQL, Visual Basic, Fault Detection, Recipe Management, Problem Solving, Process Flows, Root-Cause Analysis

Industry

Semiconductor Manufacturing

Description

Technology Development & Integration Develop and enable advanced packaging technologies that deliver cost-effective solutions with predictable reliability. Collaborate with peers to establish project timelines and verify work needed to meet objectives. Partner with internal teams and external suppliers to develop new capabilities required for advanced packaging solutions. Collaborate with peers and internal teams to implement new capabilities aligned with strategic goals. Fulfill formal communication and coordination responsibilities across work units. Promote and enforce safe, compliant behavior through regular communication and performance management. Review and respond to reports from supervisory staff, EHSS teams, and auditors. Conduct work area inspections and operational observations. Maintain area procedures and training to ensure legal compliance and adherence to management systems. Ensure smooth transition from new product development and qualification to small-volume and high-volume production. Provide proper Plan of Record (POR) documentation for product transfer to manufacturing. Work with internal teams to support new product and technology transfers. B.S/M.S./Ph.D. (or equivalent education) in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, Material, or other related technical fields 10+ years of semiconductor process integration experience, preferably with know-how to develop and enable advanced package technology for post-fab wafer finish and assembly processes Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics. Experience with Visual Basic for automation and tool integration. Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control. Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding. Strong understanding of process flows, process interactions, and ability to integrate semiconductors while partnering with process and product engineering team Ability to resolve complex issues through root-cause or model-based problem solving Tenacity to work effectively under timelines and limited resources Consistent track record to solve problems and address root causes

Responsibilities

Develop and enable advanced packaging technologies while collaborating with peers and internal teams. Ensure compliance and smooth transitions from product development to production.