MTS Memory Design Engineer, HBM at Micron Technology

Richardson, Texas, United States -

Full Time

Start Date

Immediate

Expiry Date

27 Dec, 25

Salary

0.0

Posted On

28 Sep, 25

Experience

10 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Memory Design, HBM, CMOS Circuit Design, Semiconductor Device Physics, Schematic Entry, Digital Modeling, Analog Modeling, Power Delivery Network Analysis, Design Validation, Debugging, Mentorship, Collaboration, Problem Solving, Innovation, Simulation, Verification

Industry

Semiconductor Manufacturing

Description

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Heterogeneous Integration Group (HIG) is shaping the future of AI and accelerated computing by developing sophisticated memory solutions! The team focuses on designing and optimizing High Bandwidth Memory (HBM) products for AI/ML, high-performance computing (HPC), and data-centric systems, collaborating across global engineering and product teams to deliver industry-leading performance, power efficiency, and reliability. The HBM product family is growing due to high demand from industry leading semiconductor companies! As an HBM Memory Design Engineer in sustaining role you will be working with teams like Design Engineering (DE), Product Engineering (PE), Process Integration, Packaging and Technology Development (TD) on evaluating silicon issues seen on all the current HBM designs. You will interact with the architecture team to understand new or modified specification requests, and you will work with the team on implementing and verifying the design, supporting the design release to silicon and all future needs arising for the design. You will have an opportunity to rotate to a Design Engineer role and work on the next generation HBM products. Responsibilities include but not limited to: Contribute to the design, layout, and optimization of Memory, Logic, and Analog circuits for HBM products. Parasitic modeling and assisting in design validation, reticle experiments, and required tape-out revisions. Collaborate with layout teams to meet floorplanning, placement, and routing requirements. Simulate and verify designs using industry-standard tools (e.g., FINESIM, HSPICE, Verilog). Perform extensive power delivery network analysis and optimization. Assist in running various design checks prior to initial tapeout and revision tapeout. Maintain technical expertise through continuous training and cross-group communication. Drive innovation for future memory generations in a dynamic, collaborative environment. Be proactive in identifying and flagging design issues, performance problems, and opportunities to improve design performance and reduce power consumption. Debug and identify root causes and solutions for pre-silicon and post-silicon issues encountered in current HBM products. Engage with Standards, CAD, modeling, and verification groups to ensure the design quality. Provide mentorship and support to recent graduates joining the team. Review and check design specifications to ensure high quality. Engage with various teams like Product Engineering, Test, Probe, Process Integration, Packaging, Technology Development and Marketing to ensure performance & manufacturability, to support issues with current HBM designs and find opportunities to innovate on future HBM solutions. Mentor new experienced hires. Minimum Qualifications: BS or MS in Electrical Engineering or a related equivalent field. Proven relevant experience of 12+ years with BS or 10+ years with MS. Extensive knowledge of CMOS circuit design and good understanding of semiconductor device physics. Experience with schematic entry, digital (Verilog) and analog (FastSpice & Hspice) modeling and simulations. Good understanding of timing/area/power/complexity trade-offs in DRAM or mixed-signal design. Extensive knowledge with DRAM operation and JEDEC specifications, preferably with the HBM product family. Experience in power delivery network analysis and optimization. Experience delivering highly technical solutions. In depth technical expertise in one or more areas - memory array design, high-speed clocking and interface development, logic and custom circuit design, power delivery optimization, CMOS & semiconductor device physics, 2.5D and 3D packaging technologies Preferred Qualifications: Good verbal and written communication skills with the ability to efficiently synthesize and convey sophisticated technical concepts to other team members and leadership. A self-motivated, hard-working team player who enjoys working with diverse abilities and backgrounds. Excellent problem-solving and analytical skills. Experience with scripting languages (Python, TCL, Perl, etc.) Proven track record of innovation and problem-solving in high-performance memory development. Prior experience with RTL Design flow, in DRAM process or Foundry process. Good understanding of Memory subsystem operation in high-performance computing applications. Prior experience with DRAM product bring-up and debug. Prior experience with package technologies (TSV, hybrid bonding, interposers, etc). Strong process technology development experience and understanding of both IDM, as well as Foundry operating models As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits. Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws. To learn about your right to work click here. To learn more about Micron, please visit micron.com/careers For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at hrsupport_na@micron.com or 1-800-336-8918 (select option #3) Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards. Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron. AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification. Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.

Responsibilities

As an HBM Memory Design Engineer, you will evaluate silicon issues in current HBM designs and collaborate with various engineering teams. You will also contribute to the design, layout, and optimization of memory circuits while driving innovation for future memory generations.