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New College Grad - Process Integration Engineer at Micron Technology
Boise, Idaho, United States -
Full Time

Start Date

Immediate

Expiry Date

06 Feb, 26

Salary

0.0

Posted On

08 Nov, 25

Experience

0 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

No

Skills

Process Integration, Root Cause Analysis, Failure Analysis, Design of Experiments, Yield Improvement, Quality Assurance, FMEA, 8D, SPC, FDC, MOSFET, DRAM, CMOS, JMP, Technology Transfer, Process Optimization

Industry

Semiconductor Manufacturing

Description
Act as a module owner to conduct root cause investigations and failure analysis in time-sensitive environments. Drive improvements in yield, cost efficiency, and quality. Run Design of Experiments (DOE) to enhance process capability and margin. Monitor trends and sustain line stability. Address top detractors to improve device yield and reliability. Lead workshops during technology transfer for next-generation devices. Start up, develop, and optimize processes for product quality and reliability. Identify and resolve process-related issues using FMEA, 8D, SPC/FDC methodologies. Coordinate and execute process, equipment, and material evaluations. Validate and qualify new processes, tools, and materials for new product introduction. Manage and audit material suppliers to meet quality, cost, and risk objectives. Support internal and external audits. Be willing to travel internationally for 3+ months for tech transfer/training. Be prepared to work a shifted schedule as required. Bachelor's degree in Materials Science, Electrical, Electronics, Chemical, or related engineering fields. Basic understanding of MOSFET and DRAM operation. Knowledge of CMOS and characterization methods. Familiarity with DOE, SPC, and JMP. Ability to support SPC/FDC/RMS/APC systems and site-to-site portability. Master's or Ph.D. degree in a relevant field. Internship experience in a 300mm semiconductor environment.
Responsibilities
Act as a module owner to conduct root cause investigations and failure analysis in time-sensitive environments. Drive improvements in yield, cost efficiency, and quality while leading workshops during technology transfer for next-generation devices.