Start Date
Immediate
Expiry Date
19 Aug, 26
Salary
0.0
Posted On
21 May, 26
Experience
5 year(s) or above
Remote Job
Yes
Telecommute
Yes
Sponsor Visa
No
Skills
Semiconductor Packaging, Wire Bonding, Dicing, Die Attach, AutoCAD, 8D, SPC, DFMEA, DOE, Data Analysis, JMP, Minitab, Power BI, Power Module Packaging, Solder Ball, Cu Pillar
Industry
Semiconductor Manufacturing