Package Health Engineer at Micron Technology

Taichung, , Taiwan -

Full Time

Start Date

Immediate

Expiry Date

06 Jun, 26

Salary

0.0

Posted On

09 Mar, 26

Experience

2 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

DFT Strategies, Simulation, Mechanical Characterization, Thermal Characterization, Electrical Characterization, Data Analysis, Root Cause Analysis, Predictive Models, Python, MATLAB, JMP, Semiconductor Packaging, Reliability Engineering, Failure Analysis, DRAM Testing, ASIC Testing

Industry

Semiconductor Manufacturing

Description

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Develop and implement DFT strategies for advanced packaging. Conduct simulations for mechanical, thermal, and electrical performance. Perform electrical and mechanical characterization of packages. Analyze test and field data to identify early indicators of package degradation. Collaborate with data scientists to build predictive models for package health. Support root cause analysis and corrective actions for reliability issues. Qualifications Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, or related field. 2+ years of experience in semiconductor industry (complex products preferred), preferably in packaging, test, or reliability engineering. Hands-on experience with simulation tools and test equipment, working on package characterization, reliability testing or electrical failure analysis. Proficiency in statistics, data analysis and scripting (e.g., Python, MATLAB, JMP). Strong understanding of semiconductor packaging process, material interaction and properties. Good knowledge of DRAM or ASIC product testing, test architecture, and packaging fail modes. About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience. To learn more, please visit micron.com/careers All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status. To request assistance with the application process and/or for reasonable accommodations, please contact at hrsupport_taiwan@micron.com. Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards. Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron. AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification. Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.

Responsibilities

The role involves developing and implementing Design for Testability (DFT) strategies for advanced packaging, alongside conducting various performance simulations and characterizations. Responsibilities also include analyzing test and field data to identify degradation and supporting root cause analysis for reliability issues.