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Package Health Manager / Senior Manager, Advanced Packaging Technology Deve at Micron Technology

, , Singapore -

Full Time

Start Date

Immediate

Expiry Date

05 Jan, 26

Salary

0.0

Posted On

07 Oct, 25

Experience

10 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Package Health Monitoring, Diagnostics, DFT Methodologies, Test Coverage Strategies, Simulation Studies, Mechanical Stress, Thermal Behavior, Electrical Performance, Failure Detection, Data Analytics, Qualification Testing, Reliability Testing, Communication, Stakeholder Management, Package Characterization, AL/ML Applications

Industry

Semiconductor Manufacturing

Description

Manage engineering teams responsible for package health monitoring and diagnostics. Drive implementation of DFT methodologies and test coverage strategies. Lead simulation studies for mechanical stress, thermal behavior, and electrical performance. Coordinate development of engineering solutions for failure detection and prevention. Collaborate with IT and data science teams to deploy analytics dashboards and models. Support qualification and reliability testing for new packaging technologies. B.S/M.S./Ph.D. (or equivalent education) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields 8 or more years of semiconductor packaging, test, or reliability engineering. Experience managing technical teams and cross-functional projects. Knowledge of simulation tools and data analytics platforms Familiarity with AL/ML applications in manufacturing or reliability Experience with package characterization techniques and standards Strong communication with stakeholder management skills

Responsibilities

Manage engineering teams responsible for package health monitoring and diagnostics. Drive implementation of DFT methodologies and test coverage strategies.