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Package Health Manager / Senior Manager, Advanced Packaging Technology Deve at Micron Technology

, , Singapore -

Full Time

Start Date

Immediate

Expiry Date

30 Jan, 26

Salary

0.0

Posted On

01 Nov, 25

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Package Health Monitoring, Diagnostics, DFT Methodologies, Test Coverage Strategies, Mechanical Stress Simulation, Thermal Behavior Simulation, Electrical Performance Simulation, Failure Detection, Failure Prevention, Data Analytics, Qualification Testing, Reliability Testing, AI/ML Applications, Package Characterization, Communication Skills, Stakeholder Management

Industry

Semiconductor Manufacturing

Description

Manage engineering teams responsible for package health monitoring and diagnostics. Drive implementation of DFT methodologies and test coverage strategies. Lead simulation studies for mechanical stress, thermal behavior, and electrical performance. Coordinate development of engineering solutions for failure detection and prevention. Collaborate with IT and data science teams to deploy analytics dashboards and models. Support qualification and reliability testing for new packaging technologies. Master's or Bachelor's degree in Engineering or related field. 7+ years of experience in semiconductor packaging, test, or reliability engineering. Experience managing technical teams and cross-functional projects. Knowledge of simulation tools and data analytics platforms. Familiarity with AI/ML applications in manufacturing or reliability. Experience with package characterization techniques and standards. Strong communication and stakeholder management skills.

Responsibilities

Manage engineering teams focused on package health monitoring and diagnostics. Lead the implementation of methodologies and coordinate the development of engineering solutions for failure detection and prevention.