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Package Health - Principal/Staff/Senior Engineer, Advanced Packaging Techno at Micron Technology

, , Singapore -

Full Time

Start Date

Immediate

Expiry Date

30 Jan, 26

Salary

0.0

Posted On

01 Nov, 25

Experience

2 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

DfT Strategies, Simulation Tools, Test Equipment, Package Characterization, Reliability Testing, Electrical Failure Analysis, Statistics, Data Analysis, Scripting, Semiconductor Packaging, Material Interaction, DRAM Testing, ASIC Testing, AI/ML Tools, Statistical Modeling, Reliability Standards

Industry

Semiconductor Manufacturing

Description

Develop and implement DFT strategies for advanced packaging. Conduct simulations for mechanical, thermal, and electrical performance. Perform electrical and mechanical characterization of packages. Analyze test and field data to identify early indicators of package degradation. Collaborate with data scientists to build predictive models for package health. Support root cause analysis and corrective actions for reliability issues. Bachelor's or Master's degree in Electrical Engineering, Materials Science, or related field. 2+ years of experience in semiconductor industry (complex products preferred), preferably in packaging, test, or reliability engineering. Hands-on experience with simulation tools and test equipment, working on package characterization, reliability testing or electrical failure analysis. Proficiency in statistics, data analysis and scripting (e.g., Python, MATLAB, JMP). Good knowledge of semiconductor packaging process, material interaction and properties. Good knowledge of DRAM or ASIC product testing, test architecture, and packaging fail modes. Experience with AI/ML tools or statistical modeling. Familiarity with JEDEC or other reliability standards. Strong problem-solving and documentation skills

Responsibilities

Develop and implement DFT strategies for advanced packaging and conduct simulations for mechanical, thermal, and electrical performance. Analyze test and field data to identify early indicators of package degradation and support root cause analysis for reliability issues.