Piper Companies is hiring a Package Layout Designer (Substrate) for a small start up based in Saratoga, CA. The Package Layout Designer (Substrate) will be driving the entirety of the layout to come up with a conclusion for this packaging and design the physical layout for package substrate technology. The Package Layout Designer (Substrate) will need to sit on site 5 days per week in Saratoga, CA.

REQUIREMENTS FOR THE PACKAGE LAYOUT DESIGNER (SUBSTRATE):

• 8+ Years of experience designing the physical layout design for package substrate technology
• Expertise in layout design work
• Experience working with ASIC, Signal and Power Teams
• Advance Knowledge in Allegro Cadence APD and AutoCAD design tools

• Drive high-density substrate designs for advanced multi-die packages
• Plan bump maps, escape routes, vias, and layer stack-ups
• Assess routing feasibility with respect to die layout and mechanical constraints
• Align floor planning with system, packaging, and mechanical teams
• Optimize signal, power, and ground integrity through smart routing
• Perform DRC, DFM, and manufacturing rule checks
• Finalize design packages and coordinate with substrate vendors
• Support layout reviews and incorporate stakeholder feedback