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Package Reliability Process Engineer at Micron Technology

Simpang Ampat, Penang, Malaysia -

Full Time

Start Date

Immediate

Expiry Date

15 Feb, 26

Salary

0.0

Posted On

17 Nov, 25

Experience

2 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Qualification Plan, Risk Assessment, Failure Analysis, Process Reliability, Test Methodology, Industry Standards, Process Sampling, Data Analysis, Material Disposition, Technology Nodes, Process Monitoring, Failure Mechanisms, Coordination, Evaluation Management, R&D Collaboration, Process Testing

Industry

Semiconductor Manufacturing

Description

Define qualification plan Facilitate and manage qualification Comprehend failures and failure rates within the scope of the qualification Perform risk assessment at all decision points within the qualification cycle Coordinate with Research and Development (R&D) teams Comprehend new processes/technologies for process reliability issues Develop process reliability tests to assess new process failure mechanisms Ensure that test methodology follows industry standards, such as the Joint Electron Devices Engineering Council (JEDEC) Define process sampling plan and instruction. Analyze and report results Analyze failures and coordinate failure analysis Develop process monitor plan Support Excursion Material Disposition Provide support for R&D for new technology nodes Facilitate and manage evaluations

Responsibilities

The Package Reliability Process Engineer will define and manage qualification plans while analyzing failures and coordinating failure analysis. They will also develop process reliability tests and ensure compliance with industry standards.