Packaging Development Engineer (NCG) at Sandisk

Shanghai, Shanghai, China -

Full Time

Start Date

Immediate

Expiry Date

15 May, 26

Salary

0.0

Posted On

14 Feb, 26

Experience

0 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

New Technology Design, Material Design, Equipment Design, New Product Design, Mass Production Deployment, Innovation Solution, Multidisciplinary Projects, International Teamwork, English Proficiency

Industry

Semiconductor Manufacturing

Description

Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape. Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality. Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward. Job Description Packaging Development Engineer New technology, material and equipment design, development and deployment in co-operation with internal and external team. New product design, development and deployment until product move to mass production. Bring innovation solution and technology across new technology and new product development. Team work in English language with a multitude of international interfaces is mandatory. Qualifications Master degree with major in material science / Mechatronic Technology as priority. Preferred intern in assembly technology especially in SanDisk or similar company. Passion for developing technical solutions in multidisciplinary international projects Excellent English skills (verbal and written); willingness to travel as required. Additional Information Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution. Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at [email protected] to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying. Business Function: Packaging Engineering Work Location: Shanghai SNDK Minhang Office--LOC_SNDK_Shanghai SNDK Minhang

Responsibilities

The role involves the design, development, and deployment of new technology, materials, and equipment in collaboration with internal and external teams. This includes driving new product design and development until the product transitions to mass production, bringing innovative solutions across development efforts.