Packaging Engineer at Advanced Micro Devices, Inc

Singapore, , Singapore -

Full Time

Start Date

Immediate

Expiry Date

04 Feb, 26

Salary

0.0

Posted On

06 Nov, 25

Experience

10 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Semiconductor Packaging, Metrology, Characterization, Data Collection, Analysis, Thermal Testing, Mechanical Testing, Electrical Characterization, Statistical Methods, Collaboration, Technical Leadership, Mentoring, Material Characterization, Process Characterization, Design Characterization, Strategic Partnerships

Industry

Semiconductor Manufacturing

Description

WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career. THE ROLE: Lead experimental validation and characterization of advanced packaging solutions such as 2.5D/3D, CPO, power delivery and HSIO solutions. Responsibilities include thermal, mechanical and electrical characterization of passive devices like capacitors, resistors and voltage regulators and establishing core packaging lab capabilities. THE PERSON: The ideal candidate is a highly collaborative leader with strong technical background in semiconductor packaging, metrology, and characterization who will ensure alignment with technology and product roadmaps. KEY RESPONSIBILITIES: Establish Packaging Lab Capabilities: to drive experimental validation and characterization of advanced packaging solutions such as 2.5D/EFB/CoWoS/WLFO, CPO, CoW/WoW 3D die stacking, BSPDN, power delivery, HSIO & connector technologies. Lead Data Collection & Analysis: efforts, collaborating with internal teams (characterization labs, reliability, failure analysis, design, test) and external partners (foundries, OSATs, suppliers, universities). Drive Technology & Product Roadmap Enablement: define and lead comprehensive material, process, and design characterization aligned to technology and product roadmaps. Cultivate Strategic Partnerships: develop and maintain strong, strategic partnerships with internal engineering teams across packaging, reliability, device analysis, test, technology integration, and product development, and build collaborative relationships with external partners to leverage their expertise and resources. Provide Technical Leadership: provide expert guidance on metrology and package characterization techniques. Stay abreast of industry trends and advancements in semiconductor packaging and characterization. Mentor and guide junior engineers and technicians. PREFERRED EXPERIENCES: 10+ years of experience in packaging, metrology, characterization, design validation of components, packages and platforms. Experience with a variety of characterization methods including optical/electron microscopy, thermal-mechanical testing (micromechanical testers, DIC, DMA, TMA, DSC, rheometer), shadow moire, x-ray imaging, spectroscopy (EDS, FTIR, XRF), and chromatography (IC, GC-MS). Experience with data collection and analysis, including statistical methods. Demonstrated ability to work independently and in a team environment. ACADEMIC CREDENTIALS: Advanced degree (MS minimum, PhD preferred) in mechanical engineering, electrical engineering, material science, physics or equivalent. LOCATION: Singapore #LI-JV1 Benefits offered are described: AMD benefits at a glance. AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

Responsibilities

Lead experimental validation and characterization of advanced packaging solutions. Establish core packaging lab capabilities and drive technology and product roadmap enablement.