Packaging Engineer at Advanced Micro Devices, Inc

Taichung, , Taiwan -

Full Time

Start Date

Immediate

Expiry Date

07 Sep, 26

Salary

0.0

Posted On

09 Jun, 26

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

CoWoS, Advanced Package Assembly, FMEA, Control Plan Methodology, Data Analysis, JMP, Snowflake, Power BI, Substrate Integration, Bump Integration, Failure Analysis, Package Reliability, Supplier Quality Management, 8D Principle, Statistical Process Control, Project Management

Industry

Semiconductor Manufacturing

Description

WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career. THE ROLE: We are looking for a candidate who can manage and drive external packaging & assembly suppliers on delivering or exceeding target performance in New Product Introduction, Supplier Manufacturing Operations, Quality and Reliability issue free processes, and Pathfinding new capabilities. AMD's environment is fast paced, results oriented and built upon a legion of forward-thinking people with a passion for winning technology! THE PERSON: The successful candidates must be a team player with a commitment to meeting deadlines, have a drive for solutions and an aptitude to thrive with the ability to work in a fast-paced multi-tasking environment. He or she would have in-depth technical knowledge, excellent cross functional project management skills, conflict management skills, strong interpersonal skills with good presentation & communication skills. Demonstrating strong leadership to excel in his/her work with minimum supervision and strong interest to develop a career in AMD. KEY RESPONSIBILITIES: Drive IC packaging initiatives from product qualification to production ramp for next generation Advance Packages. Collaborate with substrate and assembly suppliers to define process flow and process controls to enable high reliability manufacturing. Drive manufacturing process quality through FMEA and lead comprehensive reliability evaluations to determine the quality and reliability margin for the product. Using AI to drive data analytics program and detect manufacturing and product quality excursion to safeguard product quality. Research and develop solutions to enhance package reliability for end users. Innovate methods by applying AI agent to add more value to the product through optimizing product cost, yield and performance. Lead collaboration with suppliers to meet AMD's goals (cost, yield, quality and reliability) and continuous improvement activities. Lead investigations, risk assessments on quality activities including PCN, lot on holds, issues including MRB, customer complaints, RMA. PREFERRED EXPERIENCE: 5+ years of hand on experience in end to end of CoWoS & Advanced Package assembly process. Strong knowledge in FMEA & Control Plan methodology Strong knowledge in data analysis tools (JMP, Snowflake, Power BI…etc.) Experience on substrate, bump and assembly integration Familiar with tools (failure analysis knowledge, package reliability knowledge) Supplier quality management experience and a deep understanding of problem-solving tools including 8D principle and statistical process control principles Strong leadership and interpersonal skills with effective communication & presentation skills LOCATION: Taichung, Taiwan #LI-JW3 Benefits offered are described: AMD benefits at a glance. AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here. This posting is for an existing vacancy.

Responsibilities

Manage external packaging and assembly suppliers to drive IC packaging initiatives from qualification to production ramp. Utilize AI and data analytics to optimize product cost, yield, and reliability while leading quality investigations and risk assessments.