Packaging Engineer at Advanced Micro Devices, Inc

Tainan, Jiangxi, China -

Full Time

Start Date

Immediate

Expiry Date

26 Mar, 26

Salary

0.0

Posted On

26 Dec, 25

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Photonics, Packaging Solutions, Technology Development, Leadership, Communication Skills, Optical Connectors, Data Analytics, Manufacturing, Silicon Photonics, 3D Packaging, 2.5D Packaging, Yield Improvement, Process Definition, Cross-Functional Teams, Architecture Definition, Technology Qualification

Industry

Semiconductor Manufacturing

Description

WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career. THE ROLE: Technology leader to drive co-packaged optics (CPO) development from concept to production. Successful candidate would collaborate with product design teams and technology development partners to understand future product needs and define a CPO roadmap that includes process definition, Design for Manufacturing (DFM) and Design for Yield (DFY) guidelines. He/she will be responsible for driving technology development initiatives from concept to qualifications. Successful candidate would lead cross functional teams across geos in designing and developing novel technologies and processes. Si photonics based optical engine package architecture / Package integration and drive micro-optical component assembly/interface characterization through Innovation Work with foundry and OSAT to bring Si photonics packaging solution from concept to HVM. He/she will be responsible for executive level communication on technology development progress, driving technical problem solving to address yield, reliability and process development challenges as needed. The candidate will also engage with worldwide ecosystem partners to gather data, analyze, and identify solutions. THE PERSON: Should possess a proven track record of delivering innovative photonics and packaging solution from concept to production. The candidate should have a proven track record of driving technology development in the semiconductor field. He/she should have leadership experience driving engineering teams in architecture definition, process definition and/or yield improvement. The candidate should have excellent oral and written communication skills to share complex signals/recommendations with technology partners, colleagues, product architects and AMD management KEY RESPONSIBILITIES: Work with product architects in early definition stage to understand and define package architectures, roadmap Design multi-fiber optical connectors and work with external vendors to develop connector eco-system Lead new package technology development initiatives including 2.5D and 3D packaging from concept to full technology qualification Drive Test vehicle design and manufacturing to establish design rules, DFM/DFY guidelines Establish Yield roadmap and lead implementation of yield, data analytic tools as need PREFERRED EXPERIENCE: Prior experience in developing and deploying Silicon photonics solutions to the market Prior experience developing photonics coupler assembly, test, DFM Good experience in semiconductor technology development role Good experience working with manufacturing partners such as suppliers, OSATs and foundry partners. In-depth knowledge of various packaging architectures such as 3D die stacking, 2.5D CoWoS and Fan-out packaging Good experience in a leadership role driving cross-functional teams Proven track of leading technology qualification for advanced data-center products ACADEMIC CREDENTIALS: BS/MS/PhD in Material Science, Mechanical Engineering, Computer Science, Applied Mathematics, Electrical Engineering, or equivalent LOCATION: Kaohsiung, Taiwan #LI-SC1 Benefits offered are described: AMD benefits at a glance. AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

Responsibilities

The role involves driving co-packaged optics development from concept to production, collaborating with product design teams and technology partners. The candidate will lead cross-functional teams in designing novel technologies and processes while addressing yield and reliability challenges.