Packaging Engineer at Advanced Micro Devices, Inc

Hsinchu City, Taiwan, Taiwan -

Full Time

Start Date

Immediate

Expiry Date

14 Sep, 26

Salary

0.0

Posted On

16 Jun, 26

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Semiconductor Packaging, NPI Bringup, OSAT Management, Risk Assessment, Quality Validation, Engineering Change Management, 8D Problem Solving, Statistical Process Control, DOE, JMP, Autocad, AI Tools, Project Management, DFM, Vision Inspection Technology, English and Mandarin Proficiency

Industry

Semiconductor Manufacturing

Description

WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career. THE ROLE: This role is critical to sustaining ongoing deliverables and ensuring continuity of key activities, particularly in OSAT factory backend NPI bringup and production sustaining. KEY RESPONSIBILITIES: Manage New Product Introduction activities and Product Ramp Up monitoring for post-test processes by working closely with AMD internal stakeholders. Co-work with AMD internal stakeholders and drive risk assessment, processing requirement definition and qualification for new products and/or processes at external manufacturing facilities for Mark / Inspection / Pack. Depth and breadth of considerations and validation to allow seamless execution of new product bringup and LVM production ramp. Proactively communicate task assignments/status to responsible parties and ensure schedule control with quality validation. Manage external manufacturing sites to ensure parts are manufactured to product specifications and achievement of product manufacturing KPI. Drive external manufacturing sites on issue resolution / opportunities for improvement supporting on process improvement and quality enhancement.. Drive external manufacturing sites on technical cause and improvement for quality excursion resolution feedback from end customers. Timely execution of projects and special work requests, with comprehensive reports and analysis. Manage and execute Engineering change management / change controls and BOM changes. Uses of AI tools in achieving Product Performance Optimization & Tuning, Supply Chain & Manufacturing Intelligence Site support / Audit as needed with travel. Will be involved in regional vendor management. Assist in additional duties as needed by supervisor. PREFERRED EXPERIENCE: Min 8 years’ experience in Semiconductor packaging, focusing in the following areas - Test, Mark and Pack process with good knowledge of quality system. Strong technical knowledge on marking technology and vision inspection machine technology is an advantage. Experience in NPI / DFM and product shipping packaging qualification. Supplier management experience (OSAT) preferred. Experience with 8D problem solving techniques. Familiar with statistical control tools, DOE and JMP and basic Autocad. Use of AI tools (Example Copilot, Snowflake) Bachelor/MS degree in Mechanical or Material or Manufacturing Engineering Creative, highly motivated self-driven individual with the demonstrated ability to independently complete complex engineering tasks Excellent cross functional project management, communication, and presentation skills. Good in writing and speaking in English & Mandarin. ACADEMIC CREDENTIALS: Bachelor/MS degree in Mechanical or Material or Chemical Engineering LOCATION: Hsinchu, Taiwan #LI-SH1 #LI-HYBRID Benefits offered are described: AMD benefits at a glance. AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here. This posting is for an existing vacancy.

Responsibilities

Manage New Product Introduction (NPI) and production ramp-up for post-test processes at external manufacturing sites. Drive quality enhancement, issue resolution, and engineering change management to ensure products meet specifications and KPIs.